Vertical Bridge Chiplet Interconnect Without TSVs in Silicon Substrates
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Solution Overview
Problem
Conventional methods for interconnecting integrated circuit die, such as through-silicon vias (TSVs) and silicon bridges, are costly, complex, and have supply chain issues, limiting the efficiency and scalability of chiplet integration in integrated circuit products.
Innovation Solution
The use of vertical bridge chiplets with conductive routing and conductive interfaces, which eliminate the need for TSVs by providing vertical interconnects between chiplets and a semiconductor substrate, allowing for a modular chiplet system with interchangeable chiplets and reduced manufacturing complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If through-silicon vias (TSVs) are used to interconnect integrated circuit die, then vertical electrical connections are achieved, but manufacturing cost and processing complexity increase substantially
Solution Approach 1:
The patent extracts the TSV formation process from the overall interconnect structure by introducing a bridge die that provides vertical interconnect functionality without requiring TSVs in the substrate. The bridge die is attached to the substrate and provides the vertical connection path, separating the vertical interconnect function from the substrate itself.
Solution Approach 2:
The bridge die acts as an intermediary component between the substrate and the stacked die. It provides the vertical connection path through its own conductive structures (bumps, pads, and internal routing) rather than requiring TSVs through the substrate, thereby mediating the connection in a simpler manner.
2Reliability
If TSVs are formed in substrate, then vertical interconnect is achieved, but manufacturing cost increases due to substantial processing time
Solution Approach 1:
The patent removes the TSV formation requirement from the substrate manufacturing process. Instead of forming expensive TSVs in the substrate, the vertical interconnect function is extracted and provided by the bridge die, which uses standard bump and pad structures that are less costly to manufacture.
Solution Approach 2:
The bridge die serves as a disposable or replaceable component that provides the vertical interconnect function. Rather than investing in expensive and complex TSV formation in the substrate, the patent uses a simpler, more cost-effective bridge die structure that can be manufactured using standard processes.
3Adaptability or versatility
If conventional interconnect techniques are used, then chiplets can be interconnected, but supply chain issues and reticle size limitations occur
Solution Approach 1:
The patent segments the interconnect function into separate components: the substrate with its routing, the bridge die with vertical interconnect and I/O pads, and the stacked functional die. This segmentation allows each component to be manufactured independently using standard processes, reducing supply chain complexity and reticle size constraints.
Solution Approach 2:
The bridge die serves multiple functions: it provides vertical interconnect, contains I/O pads for board-level connections, and enables adaptability to different process nodes. This multi-functionality reduces the need for specialized components and simplifies the supply chain.
4Reliability
If TSV qualification is performed for high volume manufacturing, then reliability is ensured, but latest process nodes cannot be utilized due to qualification lag
Solution Approach 1:
The patent extracts the vertical interconnect function from TSVs in the substrate and relocates it to the bridge die. This allows the substrate to be manufactured using the latest process nodes without TSV qualification constraints, while the bridge die handles the vertical connection using standard, well-qualified processes.
Solution Approach 2:
Instead of qualifying TSVs in the substrate for each new process node, the patent inverts the approach by using standard process nodes for the substrate and implementing the vertical interconnect in the bridge die. This reversal allows immediate adoption of latest process nodes for the substrate while maintaining reliability through proven bridge die technology.
Data Source
AI summary
An integrated circuit product includes a vertical bridge chiplet that includes through silicon vias (TSVs) to provide power delivery or other system input/output signals to an integrated circuit device. The vertical bridge chiplet and functional chiplets are coupled to the integrated circuit device using vertical interconnect. In an embodiment, the vertical bridge chiplet uses double-sided interconnect to couple system I/O from a package or printed circuit board to the integrated circuit device and reduces or eliminates the need for the integrated circuit device to include TSVs. The vertical bridge chiplet is separately manufactured and may be included in a library of functional chiplets of a modular chiplet system for use with a set of prefabricated integrated circuit devices formed from a semiconductor substrate with a set of chiplet interfaces to serve a variety of system applications without requiring custom silicon devices.