Vertical Channel Transistor Layout With Lower Bit Line and Peripheral Gate

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Solution Overview

Problem

Current semiconductor devices face challenges in reducing element sizes while maintaining desired performance, particularly in forming reliable transistors with vertical channel structures.

Innovation Solution

The semiconductor device incorporates a vertical channel transistor with a vertical channel region and a peripheral gate, where the bit line is electrically connected at a lower level, and the peripheral gate is disposed at the same level as the bit line, enhancing integration density and electrical performance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If element sizes are reduced to increase integration density, then integration density is improved, but transistor performance deteriorates

Engineering Contradiction:
Improveintegration densityVSAvoidtransistor performance
Core Design Contradiction:
Quantity of substanceVSReliability

Solution Approach 1:

The patent transitions from planar transistor structures to vertical channel structures, utilizing the vertical dimension to maintain transistor performance while reducing horizontal footprint. The vertical channel extends in the thickness direction of the semiconductor substrate, enabling higher integration density without sacrificing drive current or switching characteristics.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent implements multiple gating structures (first gate electrode, second gate electrode, and third gate electrode) that are nested or stacked around the vertical channel in different spatial dimensions. This multi-gate configuration provides enhanced gate control over the channel while maintaining a compact footprint, resolving the contradiction between size reduction and performance maintenance.

Inventive Principle:
Principle #7Nested doll (Nesting)

2Reliability

If vertical channel structures are implemented to maintain performance at smaller sizes, then transistor performance is maintained, but floating body effects increase

Engineering Contradiction:
Improvetransistor performanceVSAvoidfloating body effects
Core Design Contradiction:
ReliabilityVSObject-generated harmful factors

Solution Approach 1:

The patent extracts or removes the semiconductor body material from beneath the vertical channel structure, creating a suspended or released channel configuration. This extraction eliminates the floating body effect by removing the bulk semiconductor material that would otherwise generate carrier accumulation and floating body effects, while maintaining the vertical channel's performance benefits.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent introduces a gate insulating film as an intermediary layer between the gate electrode and the vertical channel, and uses this same insulating layer to isolate the channel from the substrate. This intermediary structure provides electrical isolation that prevents floating body effects while maintaining effective gate control over the channel.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Quantity of substance

If bit line is positioned at lower level to improve integration, then integration density is improved, but electrical connection complexity increases

Engineering Contradiction:
Improveintegration densityVSAvoidelectrical connection complexity
Core Design Contradiction:
Quantity of substanceVSDevice complexity

Solution Approach 1:

The patent utilizes the vertical dimension by positioning the bit line at a lower level (different height) relative to the vertical channel structure. This three-dimensional arrangement allows electrical connections to be made through vertical vias or contact holes, enabling high integration density while managing connection complexity through vertical rather than horizontal routing.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS20240170574A1Semiconductor device including vertical channel transistor, bit line and peripheral gate
Publication Date: 2024.05.23 SAMSUNG ELECTRONICS CO LTD
  • US20240170574A1 patent drawing
  • US20240170574A1 patent drawing
  • US20240170574A1 patent drawing

AI summary

A semiconductor device includes a vertical channel transistor including a vertical channel region extending in a vertical direction and a cell gate electrode facing a first side surface of the vertical channel region. A bit line is electrically connected to the vertical channel transistor at a level that is lower than a level of the vertical channel transistor. A peripheral semiconductor body has at least a portion thereof disposed on a same level as the vertical channel region. Peripheral source/drain regions are disposed in the peripheral semiconductor body and are spaced apart from each other in a horizontal direction. A peripheral channel region is disposed between the peripheral source/drain regions in the peripheral semiconductor body. A peripheral gate is disposed below the peripheral semiconductor body. At least a portion of the peripheral gate is disposed on a same level as at least a portion of the bit line.