Vertical Circuit Board Cooling for Dense Server Units
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Solution Overview
Problem
In densely packed server units with multiple heat-generating components, it is challenging to direct airflow effectively for efficient cooling due to the tight arrangement of electronic components and wiring, which limits the airflow's ability to reach and cool all heat-generating components efficiently.
Innovation Solution
The design incorporates multiple circuit boards with strategically positioned openings for airflow and separate circuit boards to house electronic components controlling fan speed, allowing for increased airflow volume and routing of wiring without obstructing airflow paths, while maintaining a compact unit size by using a combination of horizontal and vertical board arrangements and shared fans between sub-units.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If electronic components are arranged densely to increase integration, then device functionality is improved, but airflow access to heat generating components is blocked
Solution Approach 1:
The patent transitions from a traditional horizontal PCB layout to a three-dimensional configuration where circuit boards are arranged vertically and stacked in multiple layers. This dimensional change creates vertical airflow channels that pass through openings in each board layer, allowing cooling air to reach heat generating components from multiple directions without being blocked by dense horizontal component arrangement.
2Productivity
If multiple heat generating components are provided in a single unit device to increase processing power, then productivity is improved, but cooling becomes more difficult due to limited airflow access
Solution Approach 1:
The patent divides the unit device into multiple sub-units, each containing its own heat generating component and associated circuit board. Each sub-unit has dedicated airflow openings and cooling paths, allowing independent cooling of each component. This segmentation enables multiple high-power components to coexist with adequate cooling for each, rather than competing for limited airflow in a crowded single-chamber design.
3Ease of manufacture
If circuit boards are arranged horizontally to simplify wiring, then ease of manufacture is improved, but airflow volume reaching heat generating components is reduced
Solution Approach 1:
The patent arranges circuit boards in a vertical stacked configuration rather than horizontal layout. This vertical arrangement creates unobstructed vertical airflow channels that can accommodate high volumetric airflow. The wiring is routed through vertical channels and connection points on adjacent boards, maintaining manufacturability while enabling significantly higher airflow volumes to pass through each board's openings and reach the heat generating components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances cooling efficiency by increasing airflow volume and reducing the impact of exhaust heat on adjacent components, allowing for higher performance without increasing the unit's height or design complexity, while maintaining efficient cooling of multiple heat-generating components.
Implementation Method 1
a fan 28 for creating an airflow A
Implementation Method 2
hit most of an airflow created by the fan against the heat generating components
Data Source
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AI summary
A disclosed unit device: two first circuit boards provided apart from each other in a horizontal direction; heat generating components respectively provided on the two first circuit boards; two second circuit boards provided between the two first circuit boards, arranged to stand at a distance from each other, and each having an opening; and a fan provided between the two second circuit boards and configured to cool the heat generating components on the two first circuit boards by drawing air through the opening of one of the second circuit boards and by expelling the air through the opening of the other second circuit board.