Vertical Condenser Channels for Pumpless Two-Phase Electronics Cooling
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Solution Overview
Problem
Liquid-cooled configurations for power electronics systems are costly and complex due to the need for external pumps and radiators, which complicates the cooling process for high heat-flux power semiconductor devices.
Innovation Solution
A condenser design enabling passive, pumpless two-phase heat transfer using a condenser with vertical walls and fins that facilitate condensation of a coolant, allowing for efficient heat removal from semiconductor devices without the need for external cooling systems.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If liquid-cooled configurations are used for power semiconductor devices, then heat removal efficiency is improved, but device complexity and cost increase due to external pumps and radiators
Solution Approach 1:
The invention extracts the active pumping function from the cooling system, relying on natural convection and phase change dynamics to drive coolant circulation. The two-phase cooling system uses evaporative cooling where the coolant absorbs heat and transitions to vapor, then condenses and returns to the evaporator without mechanical pumps, eliminating the complexity of pump and radiator systems while maintaining effective heat removal from power semiconductor devices
Solution Approach 2:
The invention utilizes phase transitions of the coolant between liquid and vapor states to achieve efficient heat transfer. The coolant evaporates at the heat source (power semiconductor devices) absorbing latent heat, the vapor rises and condenses in the condenser section releasing heat, and the liquid returns to repeat the cycle. This phase-change mechanism provides high heat flux removal capability without requiring complex active cooling components
2Temperature
If liquid-cooled configurations are used for power semiconductor devices, then heat removal efficiency is improved, but manufacturing cost increases due to additional components
Solution Approach 1:
The invention removes expensive active cooling components (pumps, radiators, control systems) and replaces them with a passive two-phase cooling system. The simplified design uses only the essential evaporator-condenser structure with working fluid, dramatically reducing component count, assembly complexity, and manufacturing cost while maintaining superior heat removal performance for power semiconductor devices
Solution Approach 2:
The cooling system is designed to be self-regulating and self-driven through natural convection and phase change dynamics. The coolant automatically circulates from the evaporator to condenser and back without external control or power input, eliminating the need for expensive pumps, sensors, and control electronics. The system adapts its cooling capacity to the thermal load automatically through the physics of phase change and buoyancy-driven flow
3Device complexity
If passive two-phase heat transfer is used, then device complexity is reduced, but heat transfer efficiency must be maintained without external cooling systems
Solution Approach 1:
The invention leverages the high latent heat of vaporization and condensation to achieve superior heat transfer efficiency. As the coolant evaporates at the heat source, it absorbs large amounts of heat energy per unit mass. The vapor then travels to the condenser where it releases this energy during condensation. This phase-change heat transfer mechanism provides extremely high effective heat transfer coefficients, maintaining excellent thermal performance while using a simple passive system architecture
Solution Approach 2:
The condenser is divided into multiple vertical condensation channels with fins, creating segmented heat transfer paths that enhance condensation efficiency. Each channel provides a dedicated pathway for vapor condensation and liquid drainage, increasing the effective heat transfer surface area and improving overall heat removal capability. The segmented structure optimizes the two-phase flow patterns and prevents flooding, maintaining high heat transfer efficiency in the passive system
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides an efficient and cost-effective cooling method for power-dense power electronics by utilizing passive two-phase heat transfer, effectively managing heat generated by semiconductor devices without the complexity of external cooling systems.
Implementation Method 1
a first vertical wall extending in a vertical direction, the first vertical wall defining a first plurality of vertical condensation channels within the first vertical wall
Implementation Method 2
passive two-phase heat transfer for power-dense power electronics applications
Data Source
AI summary
Provided is a condenser for use in an electronic assembly. The condenser includes a first vertical wall extending in a vertical direction, the first vertical wall defining a first plurality of vertical condensation channels within the first vertical wall, a second vertical wall extending in the vertical direction, the second vertical wall defining a second plurality of vertical condensation channels within the second vertical wall, and a first plurality of fins extending in the vertical direction, each of the first plurality of fins connected to the first vertical wall, the second vertical wall or both the first vertical wall and the second vertical wall.