Vertical Edge Coupler Structure for Low-Loss Optical Fiber Packaging
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Solution Overview
Problem
Conventional optical couplers integrated with semiconductor structures face challenges in reducing the size of the packaged structure due to their horizontal arrangement with optical fibers, which hinders further miniaturization and increases signal loss during transmission.
Innovation Solution
A vertically-arranged edge coupler is implemented with a mirror structure and lens system, allowing fibers to be positioned vertically above the coupler, minimizing device size and signal loss through focused optical signal redirection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If optical couplers are packaged at the same level as optical fiber devices over a substrate, then the structure is stable and easy to manufacture, but the device size cannot be reduced further
Solution Approach 1:
The patent transitions from a horizontal arrangement of optical fibers at the same level as the coupler to a vertical arrangement where fibers are positioned above the coupler. This dimensional change from 2D horizontal packaging to 3D vertical stacking enables further miniaturization of the device while maintaining manufacturing feasibility through established vertical integration techniques.
2Loss of energy
If optical fibers are arranged horizontally with the coupler, then the coupling is straightforward, but signal loss increases during transmission
Solution Approach 1:
The patent introduces a lens as an intermediary component between the optical fiber and the coupler. The lens focuses and redirects the optical signal from the vertically positioned fiber onto the coupler's grating structure, improving coupling efficiency and reducing signal loss while managing the complexity of vertical alignment.
3Volume of moving object
If the device size is reduced through vertical arrangement, then miniaturization is achieved, but manufacturing precision requirements increase
Solution Approach 1:
The patent incorporates lens structures and positioning features during the semiconductor fabrication process itself, rather than relying solely on post-fabrication alignment. The lens is formed as part of the device structure, and alignment marks or mechanical features are pre-integrated to guide fiber positioning, thereby reducing the precision burden on final assembly operations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables reduced device size, improved coupling efficiency, high-speed optical transmission, and lower costs for wafer-scale testing and packaging by adjusting the fiber position and minimizing signal loss.
Implementation Method 1
an optical reflective layer disposed within the dielectric layer, wherein the optical reflective layer has an inclined surface configured to redirect a traveling direction of an optical signal
Implementation Method 2
A vertically-arranged edge coupler is implemented with a mirror structure and lens system, allowing fibers to be positioned vertically above the coupler, minimizing device size and signal loss through focused optical signal redirection
Data Source
AI summary
A semiconductor structure is provided. The semiconductor structure includes a dielectric layer, a first waveguide structure, a reflective layer, a semiconductive layer, and a micro-lens. The first waveguide structure is disposed in the dielectric layer and extends along a first direction. The reflective layer is disposed in the dielectric layer and includes an inclined surface configured to redirect an optical signal from a second direction to the first direction. The semiconductive layer is disposed over the dielectric layer. The micro-lens is disposed at the semiconductive layer, wherein an optical signal travels into the semiconductive layer through the micro-lens along the second direction. A method of manufacturing the semiconductor structure is also provided.