Vertical Power FET Packaging for High Density Heat Dissipation
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Solution Overview
Problem
Current electronic packaging technologies face challenges in maximizing power density due to limitations in packaging area utilization, particularly for power switching elements like FETs, which restrict current processing per unit area in modern electronic devices.
Innovation Solution
The proposed solution involves orienting power switching elements in a vertical position relative to the printed circuit board and attaching them to a heat sink structure, allowing multiple dies to be stacked within a smaller area, thereby increasing power density by efficiently routing power and heat.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If power switching elements are arranged in a traditional planar configuration on the PCB, then the PCB area utilization is limited, but the power density (current processing per unit area) is also limited
Solution Approach 1:
The patent transitions from a two-dimensional planar arrangement of power switching elements on the PCB to a three-dimensional vertical stacking configuration. Multiple power dies are stacked vertically and attached to a heat sink structure, allowing power density to increase without proportionally increasing PCB area. This dimensional change enables multiple dies to occupy the same footprint area, directly resolving the contradiction between power density and PCB area utilization.
2Productivity
If multiple power dies are stacked vertically to increase power density, then PCB area is reduced, but heat dissipation becomes more challenging
Solution Approach 1:
The patent merges the mechanical support function and the heat dissipation function into a single integrated heat sink structure. Multiple power dies are attached vertically to this unified heat sink, which collects heat from all dies and routes it through a single thermal path to the PCB. This merging allows efficient heat management despite the vertical stacking configuration, resolving the contradiction between increased power density and heat dissipation challenges.
Solution Approach 2:
The heat sink structure acts as an intermediary between the vertically stacked power dies and the PCB. It intercepts heat from multiple dies, consolidates the thermal load, and provides a single interface to the PCB for heat dissipation. This intermediary approach simplifies thermal management while enabling high power density vertical stacking.
3Productivity
If power dies are oriented vertically to increase packing density, then more dies fit in the same area, but the packaging structure becomes more complex
Solution Approach 1:
The heat sink structure is designed to perform multiple functions simultaneously: it provides mechanical support for vertically stacked power dies, serves as a heat dissipation pathway, and acts as an electrical interconnection structure. By making the heat sink multi-functional, the patent reduces the need for separate support structures and simplifies the overall packaging architecture, resolving the contradiction between increased power density and packaging complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly enhances power density by allowing multiple power dies to be packed in the same area as a single die, while effectively dissipating heat, thus supporting higher current levels and efficient operation.
Implementation Method 1
the dies can be attached to a heat sink structure, which is designed to take the heat generated by the dies onto the top of the package
Data Source
AI summary
A packaging technology in which power switching elements, such as field-effect transistors (FETs), can be oriented in a vertical position relative to the printed circuit board (PCB) on which the product is mounted. The power die including the switching element(s) can essentially stand “on end” so that they take up very little PCB area. Multiple dies can be positioned this way, and the dies can be attached to a heat sink structure, which is designed to take the heat generated by the dies onto the top of the package. The heat sink structure can be attached to a structure to route the power and analog signals properly to the desired pins/leads/balls of the finished product. Using these techniques can result in a significant increase in the power density (both PCB space and solution volume) of power switching elements, e.g., FETs.