Vertical Galvanic Deposition Device with Segmented Anode

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Solution Overview

Problem

Current galvanic metal deposition systems, particularly for vertical deposition, require significant manpower and time for maintenance and system shutdowns, leading to inefficiencies and high costs due to complex device configurations and the need for extensive manual handling.

Innovation Solution

A device and container system for vertical galvanic metal deposition, featuring a compact design with a firmly connected anode and carrier element, optimized conduit alignment, and detachable electrical connections, allowing for efficient electrolyte flow and reduced device size, enabling easier maintenance and operation without full system shutdowns.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If a complex device configuration is used for vertical galvanic metal deposition, then deposition uniformity and control are improved, but maintenance complexity and system downtime increase

Engineering Contradiction:
Improvedeposition uniformityVSAvoidmaintenance complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The device is divided into separate functional modules: anode elements with through-going conduits, carrier elements, and substrate holders. These segments can be independently maintained or replaced without shutting down the entire system, reducing maintenance complexity while preserving deposition uniformity through controlled electrolyte flow paths.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The device incorporates detachable connections and movable components that allow dynamic reconfiguration during operation. The anode elements can be independently accessed and maintained while the system continues to function, transforming a static complex system into a dynamically maintainable one.

Inventive Principle:
Principle #15Dynamics

2Reliability

If traditional electroplating systems are used, then metal deposition capability is achieved, but system maintenance requires full shutdown and extensive manpower

Engineering Contradiction:
Improvedeposition capabilityVSAvoidsystem availability
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

The electroplating system is segmented into independently maintainable components including separate anode elements, carrier elements, and substrate holders. This allows maintenance personnel to service individual components without shutting down the entire system, maintaining deposition capability while improving system availability.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The through-going conduits in the anode elements enable self-contained electrolyte circulation and maintenance. The system can be maintained in-place without requiring external intervention for complete system shutdown, allowing continuous or rapid resumption of metal deposition operations.

Inventive Principle:
Principle #25Self-service

3Ease of repair

If extensive manual handling is required for device maintenance, then system components can be serviced, but time consumption and costs increase

Engineering Contradiction:
Improvecomponent serviceabilityVSAvoidmaintenance time
Core Design Contradiction:
Ease of repairVSLoss of time

Solution Approach 1:

The device is configured with modular segments (anode elements, carrier elements, substrate holders) that can be individually serviced. The detachable connections and through-going conduits enable maintenance personnel to access and service components without disassembling the entire system, reducing both ease of repair requirements and maintenance time.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The through-going conduits provide vertical access paths through the anode elements, allowing maintenance operations to be performed from different spatial dimensions. This enables servicing of internal components without extensive manual handling from external access points, reducing maintenance time while preserving serviceability.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

4Manufacturing precision

If a larger device setup is used, then deposition control and uniformity are achieved, but system size and handling complexity increase

Engineering Contradiction:
Improvedeposition uniformityVSAvoiddevice size
Core Design Contradiction:
Manufacturing precisionVSVolume of moving object

Solution Approach 1:

The deposition system is divided into multiple smaller functional segments (anode elements with conduits, carrier elements, substrate holders) that can be arranged in a compact configuration. This modular approach achieves the necessary deposition control and uniformity through controlled electrolyte flow distribution while reducing the overall device volume and handling complexity compared to a monolithic design.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The system ensures uniform metal deposition with reduced manpower and time requirements, minimizing system downtime and costs by allowing for quick maintenance and operation within a smaller, more efficient setup.

Implementation Method 1

vertical galvanic metal, preferably copper, deposition on a substrate

Methodology Applied
Scientific EffectElectroplating: Electroplating

Implementation Method 2

galvanic metal deposition

Methodology Applied
Scientific EffectGalvanic deposition: Electrodeposition

Implementation Method 3

at least one through-going conduit extending through the at least first anode element and the at least first carrier element

Methodology Applied
Scientific EffectFluid flow: Convection

Data Source

PatentUS9534310B2Device for vertical galvanic metal, preferably copper, deposition on a substrate and a container suitable for receiving such a device
Publication Date: 2017.01.03 ATOTECH DEUT GMBH & CO KG
  • US9534310B2 patent drawing
  • US9534310B2 patent drawing
  • US9534310B2 patent drawing

AI summary

The present invention is related to a device for vertical galvanic metal, preferably copper, deposition on a substrate, a container suitable for receiving such a device and a substrate holder, which is suitable for receiving a substrate to be treated, and the use of such a device inside of such a container for galvanic metal, in particular copper, deposition on a substrate.