Electronic Module Vertical Interconnects Shorting Risk
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Solution Overview
Problem
Existing electronic modules for high power applications face challenges in achieving high power density, thermal performance, and reliable interconnects while minimizing footprint and risk of shorting.
Innovation Solution
The development of electronic modules with vertical interconnects made of conductive materials, such as copper or gold, that extend outward from substrates, providing high current and thermal pathways, and are embedded within a molding compound to reduce the risk of external shorting, and using a conductive adhesive for attachment, enabling efficient electrical and thermal connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If vertical interconnects are extended outwardly from substrates to provide high current pathways, then power and current capabilities are increased, but the risk of external shorting increases
Solution Approach 1:
The vertical interconnects are embedded within the molding compound, nesting the conductive elements within an insulating matrix. This prevents external contact between interconnects while maintaining their electrical functionality, thereby increasing power capabilities without proportionally increasing shorting risk
Solution Approach 2:
The molding compound serves as an intermediary material between the vertical interconnects and the external environment. It provides electrical insulation while allowing the interconnects to extend outward for current transport, resolving the contradiction between power capability and shorting risk
2Area of stationary object
If multiple integrated device packages are stacked vertically to reduce footprint, then area on system board is reduced, but thermal management complexity increases
Solution Approach 1:
The vertical interconnects serve dual functions as both electrical conduits and thermal pathways. By making the interconnects multi-functional, the patent reduces thermal management complexity despite the increased stacking density, allowing area reduction without proportionally increasing thermal management burden
Solution Approach 2:
The electrical and thermal functions are merged into the same vertical interconnect structures. This consolidation means that the same components that carry current also conduct heat away from the devices, simplifying thermal management in the stacked configuration
3Reliability
If conductive adhesive is used to attach vertical interconnects to substrates for reliable electrical connection, then electrical connectivity is improved, but thermal performance may be compromised
Solution Approach 1:
The patent optimizes the parameters of the conductive adhesive, specifically its thickness and thermal conductivity properties. By controlling these parameters, the adhesive layer maintains reliable electrical connection while minimizing thermal resistance, thus improving both electrical connectivity and thermal performance simultaneously
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables high power and thermal performance with reduced risk of shorting, supporting high current applications and efficient heat dissipation, while maintaining a compact footprint.
Implementation Method 1
mounting a first vertical interconnect to the first substrate by a conductive adhesive
Implementation Method 2
providing high current and thermal pathways
Data Source
AI summary
An electronic module can include a first integrated device package comprising a first substrate and an electronic component mounted to the first substrate. A first vertical interconnect can be mounted to and electrically connected to the first substrate. The first vertical interconnect can extend outwardly from the first substrate. The electronic module can include a second integrated device package comprising a second substrate and a second vertical interconnect having a first end mounted to and electrically connected to the second substrate. The second vertical interconnect can have a second end electrically connected to the first vertical interconnect. The first and second vertical interconnects can be disposed between the first and second substrates.