Vertical LED Cell Matrix with Insulating Layers
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Solution Overview
Problem
Existing light emitting diodes (LEDs) face issues with short circuits due to metallic etch byproducts, reduced light extraction efficiency, and degradation of reflective metal layers due to oxidation, which affect their performance and reliability.
Innovation Solution
A light emitting device with a vertical structure featuring a support substrate, light emitting cells with conductive-type semiconductor layers, electrodes with extensions, an interlayer insulating layer of higher thermal conductivity than silver paste, and an etching prevention layer to prevent exposure of electrodes and reflective structures, ensuring smooth current distribution and preventing short circuits and oxidation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If a substrate separation process is used to improve light extraction efficiency, then light extraction efficiency is improved, but the structure becomes more complex and manufacturing difficulty increases
Solution Approach 1:
The light emitting device is divided into multiple light emitting cells arranged in a matrix pattern on the substrate, with each cell independently structured. This segmentation allows for improved light extraction in each cell while maintaining overall device functionality through the modular arrangement of cells.
Solution Approach 2:
The patent transitions from conventional planar LED structures to a vertical structure where light emitting cells are arranged in a matrix on the substrate surface, utilizing both two-dimensional space and vertical depth. This dimensional approach enables enhanced light extraction pathways without proportionally increasing structural complexity.
2Illumination intensity
If reflective metal layers are used to improve light emission, then light emission efficiency is improved, but the metal layers degrade due to oxidation
Solution Approach 1:
The patent employs composite material structures where reflective metal layers are combined with protective dielectric layers and encapsulation materials. This composite approach maintains the high reflectivity of metal layers while providing oxidation protection through the encapsulating dielectric materials, thereby preserving both light emission efficiency and long-term reliability.
3Reliability
If electrodes are exposed to improve electrical connection, then electrical conductivity is improved, but short circuits occur due to metallic etch byproducts
Solution Approach 1:
The patent introduces dielectric layers as intermediary materials between exposed electrodes and the surrounding environment. These dielectric intermediaries provide necessary electrical insulation and protection from metallic etch byproducts, while still allowing for effective electrical connections through controlled access points, thus preventing short circuits without compromising conductivity.
4Use of energy by moving object
If current is concentrated in specific areas to improve efficiency, then energy efficiency is improved, but heat dissipation becomes problematic
Solution Approach 1:
The patent segments the current distribution across multiple light emitting cells arranged in a matrix, dispersing the current pathways throughout the device structure. This segmentation allows for localized energy efficiency in each cell while distributing heat generation across the entire substrate area, improving overall heat dissipation capability.
Solution Approach 2:
The vertical arrangement of light emitting cells on the substrate creates additional thermal pathways in the vertical dimension, enabling heat to dissipate through multiple directions rather than being confined to a single plane. This dimensional approach enhances heat management while maintaining energy efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution prevents short circuits and maintains heat dissipation performance while enhancing light extraction efficiency and protecting reflective metal layers from oxidation, leading to improved reliability and efficiency of the LEDs.
Implementation Method 1
an interlayer insulating layer interposed between the support substrate and the electrodes and having a relatively higher thermal conductivity than silver paste
Implementation Method 2
a first metal layer 31 is formed on the semiconductor layers, and a second metal layer 53 is formed on a substrate 51 that is separate from the sacrificial substrate 21. The first metal layer 31 may comprise a reflective metal layer.
Data Source
AI summary
A light emitting device having a plurality of light emitting cells is disclosed. The light emitting device comprises a substrate; a plurality of light emitting cells positioned on the substrate to be spaced apart from one another, each of the light emitting cells comprising a p-type lower semiconductor layer, an active layer and an n-type upper semiconductor layer; p-electrodes positioned to be spaced apart from one another between the substrate and the light emitting cells, the respective p-electrodes being electrically connected to the corresponding lower semiconductor layers, each of the p-electrodes having an extension extending toward adjacent one of the light emitting cells; n-electrodes disposed on upper surfaces of the respective light emitting cells, wherein a contact surface of each of the n-electrodes electrically contacting with each light emitting cell exists both sides of any straight line that bisects the light emitting cell across the center of the upper surface of the light emitting cell; a side insulating layer for covering sides of the light emitting cells; and wires for connecting the p-electrodes and the n-electrodes, the wires being spaced apart from the sides of the light emitting cells by the side insulating layer.