Vertical LED Contact Pad Layout for Display Thermal Dissipation
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Solution Overview
Problem
Electronic devices with displays face challenges in achieving desired optical performance and managing power consumption due to bulky components and inefficient light emission.
Innovation Solution
The use of an illumination engine with an array of light-emitting diodes (LEDs) where each LED has vertically stacked anode and cathode contact pads, allowing for independent control of light emission and improved thermal dissipation, along with a common contact pad interposed between the driver die and individually addressable contact pads, enables efficient light management and power conservation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional horizontal LED contact pad configuration is used, then manufacturing is simpler, but thermal dissipation is insufficient and light emission uniformity is poor
Solution Approach 1:
The patent transitions from a horizontal contact pad arrangement to a vertical stacking configuration, moving the contact pads from a planar two-dimensional layout to a three-dimensional vertical arrangement. This dimensional change enables superior thermal dissipation by allowing heat to escape vertically through the LED structure, and improves light emission uniformity by optimizing the current distribution path through the vertical architecture.
2Adaptability or versatility
If individually addressable contact pads are implemented for each LED, then local dimming and dynamic brightness control are enabled, but device complexity increases
Solution Approach 1:
The patent divides the LED array into individually addressable units by providing separate contact pads for each LED or LED group. This segmentation allows the driver circuitry to independently control the brightness and activation state of each LED element, enabling local dimming zones and dynamic brightness control across different regions of the display without requiring a single monolithic control approach.
Solution Approach 2:
The vertically stacked contact pad configuration serves multiple functions simultaneously: it provides electrical connection for individual LED addressing, establishes thermal dissipation pathways, and creates optimized current distribution for uniform light emission. This multi-functionality reduces the need for separate specialized components, thereby managing device complexity while achieving advanced control capabilities.
3Temperature
If common contact pad is interposed between driver die and individually addressable contact pads, then thermal performance improves, but electrical connection path becomes more complex
Solution Approach 1:
The patent merges the thermal management function and electrical connection function into a single integrated common contact pad structure. This common contact pad serves as both a thermal pathway for heat dissipation and an electrical conductor for signal distribution, combining multiple functions into one component to simplify the overall device architecture while achieving superior thermal performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the thermal performance and uniformity of light emission, leading to improved optical performance and reduced power consumption while allowing for local dimming and dynamic brightness control in display modules.
Implementation Method 1
The illumination engine may include an array of light-emitting diodes mounted to a semiconductor die with driver circuitry
Implementation Method 2
The individually addressable contact pads and the common contact pad may be vertically stacked to improve thermal dissipation
Data Source
AI summary
An electronic device may include a display having an array of light-emitting diodes mounted to a driver die with driver circuitry for controlling the light-emitting diodes. The diodes may include contact pads. Contact pads for one of the diode terminals (e.g., the anodes or the cathodes) may be individually addressable, whereas the other diode terminals may share a common contact pad. The individually addressable contact pads and the common contact pad may be vertically stacked to improve thermal dissipation. The common contact pad may be interposed between the driver die and the individually addressable contact pads. Alternatively, the individually addressable contact pads may be interposed between the driver die and the common contact pad. Each LED array may have a dedicated driver die or one driver die may be shared between multiple LED arrays. A single LED array may include LEDs of multiple different colors.