Vertical MOSFET Heat Dissipation via Segmented Leadframe
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Solution Overview
Problem
Inefficient heat dissipation in vertical semiconductor power switches limits their stability and functionality, and poses a challenge for mounting heat dissipaters due to contact areas on both sides of the device.
Innovation Solution
An electronic component design featuring a vertical semiconductor power switch with a leadframe and contact clip configuration that allows for improved heat dissipation by exposing surfaces for thermal management, including a moisture barrier layer, and using diffusion solder bonds for secure connections without encapsulation, enabling larger switches with standard footprints.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heat dissipater is mounted on the outer surface of the semiconductor package, then heat dissipation is improved, but mounting is complicated due to contact areas on both sides of the vertical semiconductor device
Solution Approach 1:
The patent divides the contact structure into separate segments: a lower contact area for mounting on the PCB and an upper contact area for electrical connection, with the semiconductor body positioned between them. This segmentation allows the heat dissipater to be mounted on the lower contact area without interfering with the upper contact areas, resolving the mounting complexity issue while maintaining heat dissipation effectiveness.
2Power
If larger semiconductor power switches are used to meet increasing power demand, then power capacity is improved, but heat dissipation becomes less efficient and stability decreases
Solution Approach 1:
The patent transitions from planar heat dissipation to three-dimensional heat dissipation by extending the contact areas vertically and positioning them at different heights. The lower contact area serves as a heat dissipation interface with the PCB, while the upper contact area maintains electrical connection. This dimensional change allows larger power switches to dissipate heat more effectively through extended thermal pathways without compromising electrical performance.
3Temperature
If heat dissipater with fins is used to increase surface area, then heat dissipation is improved, but device complexity and mounting difficulty increase
Solution Approach 1:
The patent makes the contact areas serve multiple functions: they provide electrical connection, mechanical support, and heat dissipation interfaces. The lower contact area acts as both a mounting surface for the semiconductor device and a heat dissipation surface for the PCB, eliminating the need for separate complex heat dissipation structures like fins. This multi-functionality reduces device complexity while maintaining effective heat dissipation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances heat dissipation, reduces overheating, and accommodates larger semiconductor power switches within the same footprint, improving stability and flexibility in board design without compromising electrical performance.
Implementation Method 1
a moisture barrier layer is positioned on the exposed surfaces of the semiconductor power switch
Implementation Method 2
using diffusion solder bonds for secure connections
Data Source
AI summary
An electronic component includes at least one vertical MOSFET device, a leadframe and a contact clip. A source electrode and gate electrode are provided on a lower surface of the MOSFET device and are mounted on a source portion and a gate portion, respectively, of the leadframe. The contact clip is electrically connected between the drain electrode, which is positioned on the upper surface of MOSFET device, and a drain portion of the leadframe.