Semiconductor Structure for Vertical Optical Coupling
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Solution Overview
Problem
Conventional optical couplers integrated with semiconductor structures face challenges in reducing the size of the packaged structure due to their horizontal arrangement with optical fibers, which hinders further miniaturization and increases signal loss during transmission.
Innovation Solution
A vertically-arranged edge coupler is implemented with a mirror structure and lens system, allowing fibers to be positioned vertically above the coupler, minimizing device size and signal loss, and enabling efficient optical signal redirection and transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If optical couplers are packaged at the same level as optical fiber devices horizontally, then the structure is simple and easy to manufacture, but the device size cannot be reduced and signal loss increases
Solution Approach 1:
The patent transitions from a horizontal arrangement of optical components to a vertical arrangement. The optical fiber is positioned vertically above the semiconductor substrate, and light is coupled into the waveguide structure through a vertical interface. This dimensional change from 2D horizontal packaging to 3D vertical integration enables significant size reduction while maintaining coupling efficiency and reducing signal loss.
2Loss of energy
If horizontal edge coupling is used with optical fibers, then the coupling structure is simple, but signal loss during transmission increases
Solution Approach 1:
By changing the coupling interface from horizontal to vertical, the patent reduces signal loss. The vertical coupling geometry allows for better optical mode matching and reduces evanescent mode coupling losses that occur in horizontal configurations. The waveguide structure is designed with vertical sidewalls that facilitate efficient light coupling from the fiber.
Solution Approach 2:
The patent modifies the coupling geometry parameters by transitioning from horizontal to vertical orientation. This changes the coupling mode, the angle of incidence, and the effective overlap integral between the fiber mode and waveguide mode, resulting in reduced signal loss and improved coupling efficiency.
3Volume of moving object
If conventional horizontal packaging is used, then manufacturing is straightforward, but further miniaturization is hindered
Solution Approach 1:
The patent implements vertical integration of the optical fiber with the semiconductor device, moving from planar packaging to three-dimensional packaging. This enables the fiber to be positioned directly above the device interface, allowing for wafer-level packaging and significant size reduction. The vertical structure facilitates compact integration while maintaining manufacturability through standard semiconductor fabrication processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The vertical arrangement reduces the overall device size, enhances coupling efficiency, and supports high-speed optical transmission with reduced signal loss, facilitating wafer-scale testing and packaging.
Implementation Method 1
an optical reflective layer disposed within the dielectric layer, the optical reflective layer having an inclined surface... configured to redirect a traveling direction of the optical signal
Implementation Method 2
A lens structure is disposed between the optical fiber and the mirror structure to focus the optical signal emitted from the optical fiber
Implementation Method 3
an optical guiding layer formed between the optical reflective layers and the photodetector... configured to guide the optical signal from the optical reflective layers to the photodetector
Data Source
AI summary
A semiconductor structure is provided. The semiconductor structure includes a dielectric layer, a first waveguide structure, a reflective layer, a semiconductive layer, and a micro-lens. The first waveguide structure is disposed in the dielectric layer and extends along a first direction. The reflective layer is disposed in the dielectric layer and includes an inclined surface configured to redirect an optical signal from a second direction to the first direction. The semiconductive layer is disposed over the dielectric layer. The micro-lens is disposed at the semiconductive layer, wherein an optical signal travels into the semiconductive layer through the micro-lens along the second direction. A method of manufacturing the semiconductor structure is also provided.