Vertical PCB Power Delivery With Coupled Inductors for Low Ripple

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Solution Overview

Problem

Existing power converters face challenges in reducing current ripple while maintaining fast transient performance, especially in high-current low-voltage applications for microprocessors, leading to increased losses and peak current requirements.

Innovation Solution

A power converter circuit utilizing a multiphase coupled inductor structure with vertically stacked printed circuit boards and conductive windings to deliver current vertically, reducing current ripple and maintaining fast transient performance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Speed

If a small inductor value is used to enable fast current ramping, then transient response speed is improved, but current ripple increases leading to larger output capacitor requirements

Engineering Contradiction:
Improvetransient response speedVSAvoidoutput capacitor size
Core Design Contradiction:
SpeedVSQuantity of substance

Solution Approach 1:

The patent divides the single inductor into multiple smaller inductors arranged in a coupled configuration. This segmentation allows each inductor to have a smaller value for fast transient response while the coupled arrangement reduces the overall current ripple through phase interleaving, thereby reducing the required output capacitor size.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent combines multiple inductors into a coupled inductor structure where the inductors share a common magnetic core. This merging allows the individual small inductors to work together to reduce current ripple while maintaining fast transient response, resolving the contradiction between small inductor value and large capacitor requirement.

Inventive Principle:
Principle #5Merging (Combining)

2Quantity of substance

If multiphase interleaved design is used to achieve ripple current cancellation, then output capacitor requirement is reduced, but ripple current through MOSFET switches and inductor increases leading to higher losses

Engineering Contradiction:
Improveoutput capacitor sizeVSAvoidconduction losses
Core Design Contradiction:
Quantity of substanceVSLoss of energy

Solution Approach 1:

The patent transitions from planar PCB layout to a three-dimensional stacked configuration where inductors are vertically coupled through shared magnetic cores. This dimensional change allows for tighter coupling and more effective ripple cancellation while reducing the current path length and resistance, thereby reducing conduction losses despite the multiphase interleaved operation.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Quantity of substance

If high switching frequency is used to reduce current ripple, then current ripple is reduced, but switching losses and gate-drive losses increase

Engineering Contradiction:
Improvecurrent rippleVSAvoidswitching losses
Core Design Contradiction:
Quantity of substanceVSLoss of energy

Solution Approach 1:

The patent changes the inductor configuration parameter from single to coupled multiple inductors, which fundamentally alters the ripple current characteristics. This parameter change allows for effective ripple reduction at lower switching frequencies by utilizing the coupled inductors' ability to cancel ripple currents, thereby avoiding the increased switching losses associated with high-frequency operation.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution achieves reduced current ripple and improved efficiency by minimizing magnetic core and output capacitor size, while maintaining fast transient response.

Implementation Method 1

The multiphase coupled inductor is configured to deliver current vertically from the bottom PCB to the top PCB

Methodology Applied
Scientific EffectElectromagnetic Induction: Electromagnetic Induction

Implementation Method 2

The inductor further includes a central magnetic path between the top and bottom pieces. The central magnetic path has a higher reluctance than the plurality of magnetic paths

Methodology Applied
Scientific EffectMagnetic Reluctance: Magnetic Reluctance

Data Source

PatentUS20250317048A1System and method for vertical power delivery to electronic systems
Publication Date: 2025.10.09 TRUSTEES OF DARTMOUTH COLLEGE THE
  • US20250317048A1 patent drawing
  • US20250317048A1 patent drawing
  • US20250317048A1 patent drawing

AI summary

According to various embodiments, a power converter circuit is disclosed. The power converter circuit includes at least two vertically stacked printed circuit boards (PCBs) comprising a top PCB and a bottom PCB. The power converter circuit further includes at least one multiphase coupled inductor placed between the top PCB and the bottom PCB. The top PCB is coupled to the bottom PCB via at least one conductive winding of the multiphase coupled inductor. The power converter circuit further includes at least one circuit module placed above the top PCB and at least one power source placed below the bottom PCB. The multiphase coupled inductor is configured to deliver current vertically from the bottom PCB to the top PCB.