Vertical Photonics Chiplet Assembly for Direct Fiber Coupling
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Solution Overview
Problem
Current 2.5D and 2.1D packaging technologies face challenges in silicon photonic packaging for optical data communication systems, particularly in achieving reliable and efficient optical fiber coupling to semiconductor chips, which affects the performance and cost-effectiveness of these systems.
Innovation Solution
A vertical integrated photonics chiplet assembly is developed, featuring a package substrate with optical coupling devices, conductive via structures, and an optical fiber array, allowing for direct optical coupling to the photonics chip, thereby enhancing optical interconnects and reducing power consumption.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If 2.5D or 2.1D packaging technology is used for silicon photonic packaging, then the optical fiber coupling can be achieved, but the bandwidth is limited and power consumption is high
Solution Approach 1:
The patent transitions from planar 2.5D/2.1D packaging to a vertical three-dimensional architecture. The photonic chip is mounted vertically on the package substrate with optical coupling devices facing upward, and optical fibers are coupled from the top surface. This vertical configuration enables direct optical interconnects, eliminating the need for complex lateral optical paths in traditional 2.5D packaging, thereby increasing bandwidth and reducing signal loss.
Solution Approach 2:
The patent replaces electrical interconnects with optical interconnects for data transmission. By integrating optical coupling devices directly on the photonic chip and coupling optical fibers vertically from the top surface, the system uses light instead of electrical signals for high-speed data communication. This substitution reduces power consumption and increases bandwidth compared to traditional electrical interconnects in 2.5D packaging.
2Speed
If conventional packaging structures are used, then electrical connections can be established, but parasitic capacitance is large which limits signal transmission speed
Solution Approach 1:
The patent replaces electrical interconnects with optical interconnects for data transmission paths. By using optical coupling devices and optical fibers for high-speed data communication, the system eliminates the parasitic capacitance associated with electrical traces and interconnect structures. Optical signals are immune to capacitive effects, enabling higher signal transmission speeds without the limitations of electrical parasitics.
3Ease of operation
If optical coupling devices are positioned on the photonics chip, then optical fiber coupling is enabled, but the package substrate must be modified to expose the coupling devices
Solution Approach 1:
The patent positions optical coupling devices on the top surface of the photonic chip and couples optical fibers vertically from the top surface of the package substrate. This vertical coupling approach simplifies the package substrate structure compared to lateral coupling methods, as it requires only a simple opening or cutout region in the substrate rather than complex three-dimensional routing structures. The vertical configuration enables easier optical fiber alignment and coupling.
4Productivity
If vertical integration approach is used, then bandwidth and signal transmission speed are improved, but the manufacturing process becomes more complex
Solution Approach 1:
The patent divides the system into separate functional modules: a photonic chip for optical generation/detection, a package substrate for mechanical support and electrical interconnects, and optical fibers for optical transmission. This segmentation allows each module to be manufactured and tested independently using established processes, then assembled vertically. The modular approach reduces overall manufacturing complexity despite the vertical integration architecture.
Solution Approach 2:
The patent integrates optical coupling devices during the photonic chip fabrication process before packaging. By pre-integrating the optical coupling devices on the photonic chip substrate, the subsequent packaging process is simplified to primarily involve mounting the completed photonic chip onto the package substrate and coupling optical fibers. This preliminary integration of critical optical components reduces the complexity of the overall manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides improved bandwidth, reduced power consumption, and smaller parasitic capacitance, enabling higher speed electrical signal transmission and more efficient optical data communication.
Implementation Method 1
an optical fiber array disposed and secured within the opening, such that a plurality of optical fibers of the optical fiber array optically couple to the optical coupling devices
Data Source
AI summary
A vertical integrated photonics chiplet assembly includes a package substrate and an external device connected to a top surface of the package substrate. A photonics chip is disposed within the package substrate. The photonics chip includes optical coupling devices positioned at a top surface of the photonics chip. A plurality of conductive via structures are disposed within the package substrate in electrical connection with electrical circuits within the photonics chip. The plurality of conductive via structures are electrically connected through the package substrate to the external device. An opening is formed through the top surface of the substrate to expose a portion of the top surface of the photonics chip at which the optical coupling devices are positioned. An optical fiber array is disposed and secured within the opening such that a plurality of optical fibers of the optical fiber array optically couple to the optical coupling devices.