Vertical Probe Card Segmented Signal Path
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Solution Overview
Problem
Existing vertical probe cards suffer from signal loss due to resistance and inductance, particularly during high-frequency tests, which affects the accuracy of semiconductor chip testing.
Innovation Solution
A vertical probe card design featuring a probe with a protruding portion that reduces signal transmission distance by allowing the signal to pass between the probe head and the protruding portion, rather than through the entire probe, utilizing a PCB with a bottom hole and cover plate to house the probe, and an elastic element to maintain contact with the chip and PCB pad.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If the signal transmits through the entire probe from probe head to probe base, then the probe structure is simple and easy to manufacture, but signal loss increases due to resistance and inductance especially at high frequencies
Solution Approach 1:
The probe structure is segmented into multiple conductive paths: a first conductive path from the probe head to the protruding portion, and a second conductive path from the protruding portion to the probe base. This segmentation allows the signal to take a shorter path through the protruding portion, reducing signal loss while maintaining structural functionality.
Solution Approach 2:
The protruding portion acts as an intermediary conductive element between the probe head and the probe base. It provides a direct conductive path for the signal, mediating the transmission and reducing the effective length of the signal path, thereby minimizing resistance and inductance effects.
2Measurement precision
If the probe length is reduced to minimize signal loss, then signal transmission quality improves, but the probe cannot reach the chip surface effectively
Solution Approach 1:
The probe structure is divided into segments with different functions: the main probe body maintains sufficient length to reach the chip surface, while the protruding portion provides a separate, shorter conductive path for signal transmission. This segmentation allows the probe to simultaneously achieve adequate physical reach and optimal signal transmission quality.
Solution Approach 2:
The conductive path is extended into a third dimension by adding the protruding portion that extends laterally from the main probe body. This creates a parallel conductive path that is spatially separated from the main probe structure, allowing the signal to travel a shorter effective distance while the probe maintains its full length for chip contact.
3Loss of energy
If a protruding portion is added to create a shorter signal path, then signal loss is reduced, but the probe structure becomes more complex
Solution Approach 1:
The protruding portion is designed with localized functionality, concentrating the signal transmission function in a specific region rather than requiring the entire probe structure to be optimized. This local quality approach minimizes the impact on overall structure while achieving the signal loss reduction goal.
Solution Approach 2:
The geometric parameters of the protruding portion (such as its length, diameter, and position) can be adjusted to optimize signal transmission characteristics. By changing these parameters, the signal path length and impedance can be controlled to minimize attenuation while keeping the structural complexity manageable.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design significantly reduces signal loss during high-frequency transmissions, enhancing the accuracy of chip testing by shortening the signal path and maintaining reliable contact.
Implementation Method 1
an elastic element to maintain contact with the chip and PCB pad
Data Source
AI summary
Provided is a vertical probe card, the vertical probe card includes: a printed circuit board (PCB) including a bottom hole and a PCB pad surrounding the bottom hole; a cover plate disposed on the PCB and including a cover hole, where the cover hole and the bottom hole are disposed coaxial with each other and form a receiving space; and a probe received in the receiving space. The probe includes a probe head passing through the cover hole to extend out of the cover plate and to contact with a chip, where an end, which is provided with the probe head, of the probe is a first end; and a protruding portion disposed in the mid-portion of the probe and in contact with the PCB pad, where a part between the probe head and the protruding portion of the probe and the protruding portion are conductors.