Vertical RF Coupling Structure for Phased Array Antenna Feeds
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional printed circuit boards (PCBs) for phased array antennas are complex and costly due to the need for multiple lamination cycles and vias to connect antenna elements and RF distribution layers, increasing manufacturing complexity and costs.
Innovation Solution
The implementation of vertical coupling structures that electromagnetically couple RF signals between layers, eliminating the need for direct conductive connections via vias and simplifying the manufacturing process by reducing the number of lamination cycles and vias required.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional PCBs use multiple lamination cycles and vias to connect antenna elements and RF distribution layers, then reliable electrical connection is achieved, but manufacturing complexity and cost increase significantly
Solution Approach 1:
The patent replaces the mechanical via connection system with an electromagnetic field-based coupling system. RF coupling structures (such as capacitive or inductive couplers) are used to transmit RF signals between layers without physical conductive paths, eliminating the need for complex via arrangements while maintaining signal integrity and reducing manufacturing steps
Solution Approach 2:
The patent introduces RF coupling structures as intermediary elements between antenna elements and RF distribution layers. These couplers act as mediators that transfer RF energy through electromagnetic fields rather than direct conductive connections, simplifying the PCB architecture while ensuring reliable signal transmission
2Reliability
If conventional PCBs use multiple lamination cycles to accommodate routing lines, then complete RF signal paths are achieved, but manufacturing time and cost increase
Solution Approach 1:
The patent segments the RF signal path into independent layers connected by RF coupling structures. Each layer can be manufactured and prepared separately, then assembled with coupling structures that establish RF connections without requiring all layers to be laminated together in complex multi-cycle processes, thereby improving manufacturing efficiency
Solution Approach 2:
The patent replaces mechanical through-layer connections (vias requiring multiple lamination cycles) with electromagnetic coupling structures that can be implemented with fewer lamination steps, reducing manufacturing time and cost while maintaining complete RF signal paths
3Reliability
If conventional PCBs use numerous vias for interlayer connections, then electrical connectivity is ensured, but manufacturing cost and process complexity increase
Solution Approach 1:
The patent substitutes mechanical via-based connectivity with electromagnetic RF coupling structures. This replacement reduces the number of vias required, simplifies drilling and plating processes, and lowers manufacturing costs while ensuring reliable interlayer connectivity through field-based coupling
Solution Approach 2:
The patent extracts the connectivity function from the mechanical via system and implements it through separate RF coupling structures. This separation allows the via system to be minimized or eliminated in favor of more cost-effective coupling mechanisms that achieve the same connectivity goal
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the complexity and cost of PCBs, enabling efficient RF signal transmission while maintaining effective RF shielding and allowing for reduced-cost production of phased array antenna systems.
Implementation Method 1
The RF coupling structure is configured to electromagnetically couple a first conductive trace on the first conductive layer and a second conductive trace on the second conductive layer at RF frequencies
Implementation Method 2
a second insulation layer located between the third layer and the first layer, the second insulation layer including a first via through which the first antenna element is coupled to the first conductive trace
Data Source
AI summary
Technologies directed to coupling structures for antenna feeds of phased array antennas are described. One circuit board includes a first layer with a first portion of a RF coupling structure, a second layer with a second portion of the RF coupling structure, and a first insulation layer located between the first layer and the second layer. The RF coupling structure is configured to electromagnetically couple a first conductive trace on the first layer and a second conductive trace on the second layer at RF frequencies. The circuit board also includes an RF shielding structure coupled to a ground connection on the second layer and located in the first insulation layer. The RF shielding structure is configured to operate as a RF short circuit between the ground connection and a third conductive trace on the first layer at RF frequencies.