Vertical Semiconductor Module Design for High Power Density
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Semiconductor power converters in hybrid and electric vehicles face challenges in achieving high packaging density and cooling efficiency due to heat generation from high voltage and current applications, making it difficult to increase the density of semiconductor devices while maintaining reliability.
Innovation Solution
A semiconductor device design featuring a double-sided cooling structure with plate-shaped semiconductor elements and electrical conductors, where the semiconductor modules are arranged in a vertical-mounting configuration with insulators covering the power and signal terminals, allowing for efficient heat dissipation and increased packaging density through optimized placement and insulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If high voltage and high current are applied to drive the axle, then power output is improved, but heat generation increases making it difficult to maintain electrical insulation between terminals
Solution Approach 1:
The patent transitions from planar arrangement to three-dimensional vertical stacking of semiconductor devices. Multiple semiconductor elements are arranged in layers along the vertical direction, utilizing the thickness dimension of the substrate to increase packaging density without expanding the horizontal footprint, thereby enabling higher power output within compact constraints.
Solution Approach 2:
The patent divides the semiconductor substrate into multiple independent layers, with semiconductor elements distributed across different vertical levels. This segmentation allows independent thermal management and electrical insulation between layers, reducing heat accumulation effects and maintaining insulation integrity even under high voltage and current conditions.
2Quantity of substance
If packaging density of semiconductor devices is increased, then space utilization is improved, but heat dissipation becomes more difficult reducing cooling efficiency
Solution Approach 1:
The patent arranges semiconductor devices in the vertical dimension rather than solely in the horizontal plane. By stacking devices across multiple layers separated by insulating substrates, the design increases packaging density while maintaining vertical thermal pathways to heat sinks, preventing heat accumulation that would occur in densely packed planar configurations.
Solution Approach 2:
The patent introduces insulating substrates as intermediary layers between stacked semiconductor devices. These substrates provide both electrical insulation and thermal management functionality, allowing heat from high-power devices to be conducted away through dedicated thermal pathways while maintaining electrical isolation, thus enabling high packaging density without compromising heat dissipation.
3Temperature
If electrical conductors are connected individually to obverse and reverse surfaces for double-sided cooling, then cooling efficiency is improved, but device complexity increases
Solution Approach 1:
The patent designs the substrate to serve multiple functions simultaneously: it provides mechanical support for semiconductor elements, electrical insulation between conductors, thermal conduction pathways to heat sinks, and structural framework for the entire assembly. This multi-functionality reduces the need for separate dedicated components, thereby managing complexity while achieving effective double-sided cooling.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances cooling efficiency, reduces thermal resistance, and allows for miniaturization of semiconductor modules, improving reliability and packaging density while maintaining the semiconductor elements within safe temperature limits.
Implementation Method 1
heat is released from the electrical conductors to a cooler
Data Source
AI summary
According to one embodiment, a semiconductor device includes a first electrical conductor, a second electrical conductor, first and second semiconductors between the first and second electrical conductors, a first power terminal, a second power terminal, a signal terminal, and an insulator which covers the components. The insulator includes a flat bottom surface in which the first and second electrical conductors are exposed, a ceiling surface, a first end surface, and a second end surface. The power terminals and the signal terminal extend outwardly from the first and second end surfaces, and the ceiling surface, respectively. The first end surface, the ceiling surface, and the second end surface are formed with a parting line.