Vertically Integrated Inductor in Semiconductor Package
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Solution Overview
Problem
Conventional power converter implementations on printed circuit boards require significant area due to the need for a separate output inductor, which is often a large discrete component, making the layout inefficient in terms of space.
Innovation Solution
A semiconductor package is developed with a flip chip mounted integrated circuit (IC) and a vertically integrated inductor, where the inductor is integrated into the package itself, reducing the need for external space by using patterned conductive carriers and magnetic material to form windings around a magnetic core.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a separate discrete output inductor is used in combination with the semiconductor package, then the power converter can be implemented with conventional components, but the required PCB surface area increases significantly
Solution Approach 1:
The patent merges the semiconductor package and the output inductor into a single integrated unit. The inductor is constructed using conductive carriers and magnetic material that are vertically stacked and electrically connected to the semiconductor package, eliminating the need for a separate discrete inductor component on the PCB.
Solution Approach 2:
The patent transitions from a planar side-by-side layout to a vertical three-dimensional configuration. The inductor is positioned vertically above the semiconductor package, utilizing the vertical dimension to reduce the horizontal PCB footprint area.
2Reliability
If a large discrete output inductor is used, then the power converter can achieve required inductance values, but the layout efficiency and space utilization deteriorate
Solution Approach 1:
The patent nests the inductor structure within the semiconductor package footprint. The conductive carriers and magnetic material are arranged in a compact nested configuration where the inductor windings are formed by patterned conductive carriers positioned vertically above the package, effectively nesting the inductor within the same horizontal footprint as the semiconductor package.
Solution Approach 2:
The patent uses composite construction combining patterned conductive carriers (such as copper or aluminum layers) with magnetic material (such as ferrite or iron powder core material) to form the inductor. This composite structure achieves the required inductance values in a compact vertical arrangement, maintaining electrical performance while improving layout efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design significantly reduces the required printed circuit board surface area by integrating the inductor within the semiconductor package, enabling a more compact and efficient power converter solution.
Implementation Method 1
patterned conductive carriers and magnetic material to form windings around a magnetic core
Data Source
AI summary
In one implementation, a semiconductor package includes an integrated circuit (IC) flip chip mounted on a first patterned conductive carrier, a second patterned conductive carrier situated over the IC, and a magnetic material situated over the second patterned conductive carrier. The semiconductor package also includes a third patterned conductive carrier situated over the magnetic material. The second patterned conductive carrier and the third patterned conductive carrier are electrically coupled so as to form windings of an integrated inductor in the semiconductor package.