Vertically Stacked High-Bandwidth Storage for In-Package Data Access
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Solution Overview
Problem
Existing high bandwidth memory (HBM) devices in semiconductor packages face limitations in storage capacity and require frequent data transfer through low bandwidth communication channels, leading to bottlenecks in data processing and power management.
Innovation Solution
Integration of high bandwidth storage (HBS) devices within the semiconductor package, which include non-volatile memory dies and high bandwidth communication paths, allowing for expanded storage capacity and efficient data transfer within the package.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If data is stored in external storage devices and transferred through low bandwidth communication channels, then storage capacity is sufficient, but data transfer speed is slow and creates bottlenecks
Solution Approach 1:
The patent implements high bandwidth storage devices that are vertically stacked and integrated within the semiconductor package, nesting storage capacity directly within the processing unit. This eliminates the need for external storage and low bandwidth communication channels, providing both high storage capacity and high data transfer speed simultaneously.
Solution Approach 2:
The patent combines high bandwidth storage devices with the semiconductor package in a unified integrated structure. By merging storage and processing components within the same package using vertical stacking, the system achieves both sufficient storage capacity and high speed data access without relying on separate external storage devices.
2Quantity of substance
If more storage devices are integrated into the semiconductor package, then storage capacity increases, but device complexity increases
Solution Approach 1:
The patent transitions from horizontal expansion of storage devices to vertical stacking in the third dimension. By integrating high bandwidth storage devices vertically within the semiconductor package, the system increases storage capacity without proportionally increasing the package footprint or structural complexity, as the vertical arrangement efficiently utilizes the z-axis space.
3Productivity
If data is frequently transferred between storage and processing units, then data access is possible, but power consumption increases
Solution Approach 1:
By nesting high bandwidth storage devices directly within the semiconductor package and integrating them with processing units through high bandwidth communication paths, the system enables efficient data access without requiring frequent transfers over long distances. This reduces power consumption while maintaining high productivity.
Solution Approach 2:
The patent introduces high bandwidth communication paths as intermediaries between storage devices and processing units. These dedicated high bandwidth channels enable efficient data transfer with lower power consumption compared to using low bandwidth communication channels, thus improving data access efficiency while reducing energy usage.
Data Source
AI summary
System-in-package (SiP) devices, and associated systems and methods, are disclosed herein. In some embodiments, the SiP devices include a base substrate, as well as a processing unit a high bandwidth memory (HBM) device, and a high bandwidth storage (HBS) device each carried by the base substrate. The HBM device is electrically coupled to the processing unit through a SiP bus and includes a first interface die, one or more volatile memory dies, and an HBM bus electrically coupled to the first interface die and each of the one or more volatile memory dies. The HBS device is electrically coupled to the HBM device through the SiP bus and includes a second interface die one or more non-volatile memory dies, and an HBS bus electrically coupled to the second interface die and each of the one or more non-volatile memory dies.