Via-Hole Connection Structure Protection Layer Etching
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Solution Overview
Problem
The manufacturing process of via-hole connection structures in display panels often causes adverse effects such as corrosion or peeling of the connection portion, leading to poor contact and defects like nonuniform display in the display region.
Innovation Solution
A method involving forming an insulation layer, a first via hole, a connection portion, a protection layer, and a second via hole, with selective etching to expose the connection portion while protecting it from damage, ensuring a flat surface and maintaining electrical connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a via hole is formed directly in the insulation layer to expose the connection portion, then the manufacturing process is simple, but the connection portion suffers from corrosion or peeling due to photoresist coating and etching damage
Solution Approach 1:
A protection layer is introduced as an intermediary between the connection portion and the photoresist/etching processes. This protection layer serves as a buffer that prevents direct contact between harmful photoresist materials and the connection portion, while still allowing the via hole to be formed. The protection layer is selectively removed only where needed to expose the connection portion, thus mediating between the need for simple via formation and the need to protect the connection portion from damage.
2Productivity
If the photoresist layer is coated directly on the connection portion to form the via hole, then the etching process is efficient, but the connection portion surface becomes rough or damaged
Solution Approach 1:
The protection layer is formed in advance before the photoresist coating and etching processes. This preliminary action prepares the surface by providing a protective barrier that will remain in place during the etching operation, preventing direct damage to the connection portion. The protection layer allows efficient etching to proceed while maintaining surface quality, as it absorbs the mechanical and chemical stresses of the etching process.
3Ease of operation
If the protection layer is completely removed to expose the connection portion, then subsequent electrode formation is facilitated, but the connection portion becomes vulnerable to damage
Solution Approach 1:
The protection layer is selectively removed only in the specific local area where the via hole needs to access the connection portion, rather than being completely removed. This local removal approach maintains the protective function of the protection layer in other areas while still allowing electrode formation to proceed in the exposed via hole region. The connection portion remains protected by the protection layer in areas where it is not needed for electrical connection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method protects the connection portion, ensuring a flat surface and maintaining electrical contact, thereby improving the manufacturing process and reducing defects in the display device.
Implementation Method 1
coating a first photoresist layer on the protection layer, exposing and developing the first photoresist layer using a first mask plate to form a first etching mask
Implementation Method 2
etching the protection layer and the insulation layer using the second etching mask to form a second via hole
Data Source
AI summary
A manufacturing method of a via-hole connection structure, a manufacturing method of an array substrate and an array substrate are provided by the embodiments of the present disclosure, and the manufacturing method of the via-hole connection structure includes: forming an insulation layer on a base substrate and forming a first via hole in the insulation layer; forming a connection portion in the first via hole; forming a protection layer covering the connection portion on a surface of the insulation layer; forming a second via hole in the insulation layer and in the protection layer; removing at least a portion of the protection layer to expose the connection portion.