Via Structure Integrating Optical Channel and Electrical Conductor
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Solution Overview
Problem
Current electronic devices face challenges in efficiently transmitting signals between different boards due to limitations in optical-electrical conversion technologies, leading to reduced communication speed and increased error rates.
Innovation Solution
The integration of a substrate with a semiconductor device, a via structure containing a metallic via liner, and an optical-electrical converting device connected to both the semiconductor device and an optical channel, which allows for simultaneous electrical and optical signal transmission through a shared structure, enhancing communication efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If optical-electrical conversion technology is used for signal transmission between different boards, then communication speed can be improved, but error rates increase and system complexity increases
Solution Approach 1:
The patent combines the optical channel and electrical conductor into a single integrated via structure. The optical channel is embedded within the via structure that also contains the electrical conductor, allowing both optical and electrical signals to be transmitted through the same physical pathway. This merging reduces the number of separate components and interfaces, thereby reducing error rates while maintaining high communication speed.
Solution Approach 2:
The via structure serves multiple functions simultaneously: it provides mechanical support, electrical connection through the conductor, and optical signal transmission through the embedded optical channel. This multi-functionality reduces system complexity by eliminating the need for separate structures for each function, while improving reliability through a more integrated and stable connection.
2Reliability
If separate optical and electrical connection structures are used, then reliability can be maintained, but device complexity and occupied space increase
Solution Approach 1:
The patent merges separate optical and electrical connection structures into a single integrated via structure. The optical channel is embedded within the via structure that also contains the electrical conductor, reducing the number of discrete components while maintaining the reliability of both connection types through their coordinated integration.
Solution Approach 2:
The optical channel is nested within the via structure, which itself is embedded in the substrate. This nesting arrangement allows the optical channel to be protected and positioned precisely by the surrounding via structure and conductor, maintaining connection stability while reducing overall device complexity.
3Device complexity
If traditional electrical signal transmission is used between boards, then device complexity is minimized, but communication speed decreases
Solution Approach 1:
The patent combines optical and electrical transmission capabilities within a single via structure, providing high-speed optical communication while maintaining the structural simplicity of a traditional electrical connection. The integrated design allows optical signals to traverse the board interconnect at higher speeds without requiring complex separate mounting and connection infrastructure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution increases signal transmission speed, reduces error rates, and stabilizes the optical channel connection, enabling efficient communication between electronic devices on different boards while minimizing occupied space.
Implementation Method 1
an optical-electrical converting device disposed on the other end of the via structure, electrically connected to the semiconductor device through the conductor of the via structure, and optically connected to the optical channel
Implementation Method 2
The adhesive may include a material transparent to a visible ray, and opaque to ultraviolet (UV) light
Data Source
AI summary
An electronic device includes a substrate having a first surface and a second surface, a semiconductor device disposed on a first region on the first surface of the substrate, a via structure penetrating the substrate, and including a conductor, an optical channel disposed in the via structure, and an optical-electrical converting device disposed at an end of the via structure, electrically connected to the semiconductor device through the conductor of the via structure, and optically connected to the optical channel.