Vibration Apparatus Conductive Adhesive Bonding
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Solution Overview
Problem
The manufacturing process and structure of vibration apparatuses with piezoelectric devices are complex, leading to increased production costs and potential reliability issues with signal cable connections.
Innovation Solution
A vibration apparatus with a simplified structure and manufacturing process, featuring a vibration part connected via a film member with signal lines and an adhesive member, eliminating the need for soldering by using conductive adhesive members to ensure reliable contact between the vibration part and signal cable.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If soldering is used to connect the electrode and pad electrode, then electrical connection reliability is improved, but manufacturing complexity and production time increase
Solution Approach 1:
The patent replaces the soldering process (thermal/mechanical system) with a direct bonding structure where the electrode and pad electrode are connected through a simplified interface. This substitution eliminates the need for soldering materials and processes, reducing manufacturing complexity while maintaining electrical connection reliability through direct physical and electrical contact.
Solution Approach 2:
The patent extracts and removes the soldering step from the manufacturing process. By designing the electrode and pad electrode to connect directly without requiring soldering materials or complex soldering procedures, the manufacturing process is simplified while the essential electrical connection function is preserved.
2Reliability
If soldering is used to connect the electrode and pad electrode, then electrical connection reliability is improved, but production energy consumption increases
Solution Approach 1:
The patent replaces the energy-intensive soldering process with a low-energy direct bonding approach. By eliminating the need for soldering equipment, heating elements, and associated energy consumption, the manufacturing process becomes more energy-efficient while achieving reliable electrical connections through direct contact between the electrode and pad electrode.
Solution Approach 2:
The patent employs a simplified connection structure that eliminates expensive and energy-consuming soldering materials and processes. The direct bonding approach uses minimal materials and energy, making the manufacturing process more sustainable and cost-effective while maintaining connection reliability.
3Adaptability or versatility
If a complex structure is used in the vibration apparatus, then functional performance is improved, but manufacturing simplicity is reduced
Solution Approach 1:
The patent extracts unnecessary structural complexity from the vibration apparatus by implementing a streamlined connection between the electrode and pad electrode. This simplified structure maintains all essential functional performance while reducing manufacturing complexity, making the device easier and more cost-effective to produce.
Solution Approach 2:
The patent merges the electrode and pad electrode into a unified, simplified connection structure. By integrating these components directly without intermediate soldering steps or complex interconnection structures, the overall device complexity is reduced while functional performance is preserved, enhancing ease of manufacture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces production energy and enhances contact reliability between the vibration apparatus and signal cables, simplifying the manufacturing process and eliminating the need for soldering, thereby improving the structural integrity and efficiency of the vibration apparatus.
Implementation Method 1
an adhesive member which contacts the film member and the vibration part with the at least one signal line therebetween
Data Source
Figure 1
Figure 2~3
Figure 4A~4B
AI summary
A vibration apparatus includes a vibration part, a film member including at least one signal line connected with the vibration part, and an adhesive member adjacent to the film member and the vibration part with the at least one signal line therebetween.