Vibration Sensor Module Sealing Structure Against Casing Deformation

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Solution Overview

Problem

The vibration pickup casing of the vibration pickup unit is easily affected by abnormal external forces, leading to deformation and affecting the performance of the vibration pickup film.

Innovation Solution

A vibration sensor module design that includes a substrate, a first casing with an open end on the substrate forming a sealing chamber, a vibration pickup unit with a second casing and an elastic vibration pickup member, and a sensor unit with a sensor chip on the second casing, protected by the first casing and substrate enclosure, eliminating direct external force impact and reducing the need for a three-layer PCB structure.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If the vibration pickup unit is arranged outside the sealing casing, then the open end of the vibration pickup casing can be arranged on the outer surface of the sealing casing for external vibration collection, but the vibration pickup casing is easily subjected to abnormal external force causing deformation and affecting the vibration pickup film performance

Engineering Contradiction:
Improvevibration collection capabilityVSAvoidvibration pickup film performance
Core Design Contradiction:
Ease of operationVSReliability

Solution Approach 1:

The device is divided into two separate casings: a sealing casing that protects internal components and a vibration pickup casing that collects external vibrations. The vibration pickup casing is specifically designed with reinforced structures at positions corresponding to the vibration pickup film to prevent deformation from external forces, while the sealing casing maintains the protected environment for the vibration pickup unit and sensor unit.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The sealing casing is designed with a protective structure that preemptively shields the vibration pickup unit from abnormal external forces. The casing includes reinforced regions and protective barriers positioned to absorb or deflect external impacts before they can reach and deform the vibration pickup film, ensuring the film maintains its performance characteristics.

Inventive Principle:
Principle #11Beforehand cushioning (Prior cushioning)

2Reliability

If the vibration pickup casing is made more robust to resist external forces, then the protection of the vibration pickup film improves, but the device complexity and manufacturing cost increase

Engineering Contradiction:
Improvevibration pickup film protectionVSAvoidcasing structure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

Instead of making the entire vibration pickup casing uniformly robust, the design segments the protective features to specific locations where external forces are most likely to impact the vibration pickup film. This localized reinforcement approach provides necessary protection while minimizing overall structural complexity and material usage.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The casing structure implements local quality by providing enhanced protection only at critical positions corresponding to the vibration pickup film, while other areas maintain simpler structures. This selective reinforcement optimizes the balance between protection and complexity by concentrating structural strength where it is most needed.

Inventive Principle:
Principle #3Local quality

3Reliability

If a three-layer PCB structure is used to protect the vibration pickup unit, then the protection against external forces improves, but the manufacturing cost increases

Engineering Contradiction:
Improvevibration pickup unit protectionVSAvoidmanufacturing cost
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The vibration pickup unit is extracted from the traditional PCB-integrated design and placed within a dedicated sealing casing with specialized protective structures. This separation allows the use of cost-effective casing materials and manufacturing processes while achieving the required protection level, avoiding the need for expensive multi-layer PCB constructions.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The design employs a cost-effective sealing casing structure that provides adequate protection without requiring expensive multi-layer PCB constructions. The casing is designed to be manufacturable using standard, cost-efficient processes while delivering the necessary protection for the vibration pickup unit in typical application environments.

Inventive Principle:
Principle #27Cheap short-living objects (Disposable)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design protects the vibration pickup unit from external forces, improves reliability, reduces costs, and enhances the performance of the elastic vibration pickup member by keeping it away from vibration-sensitive positions.

Implementation Method 1

an elastic vibration pickup member arranged in the second casing

Methodology Applied
Scientific EffectElasticity: Elasticity

Implementation Method 2

the sensor unit is used to convert the vibration signal into an electrical signal

Methodology Applied
Scientific EffectPiezoelectric effect: Piezoelectric Effect

Data Source

PatentUS12501196B2Vibration sensor module and electronic device
Publication Date: 2025.12.16 GOERTEK MICROELECTRONICS CO LTD
  • US12501196B2 patent drawing
  • US12501196B2 patent drawing
  • US12501196B2 patent drawing

AI summary

A vibration sensor module including: a substrate, a first casing, a vibration pickup unit, and a sensor unit. The first casing has an open end on the substrate, the first casing and the substrate are enclosed to form a sealing chamber, and the first casing includes a first top plate opposite to the substrate. The vibration pickup unit is arranged in the sealing chamber, the vibration pickup unit includes a second casing with an open end and an elastic vibration pickup member arranged in the second casing, the open end of the second casing is arranged on the substrate or the first top plate, and the second casing is provided with a vibration transmission through hole. The sensor unit includes a sensor chip arranged on an outer surface of the second casing, and a back cavity of the sensor chip corresponds to the vibration transmission through hole.