Virtual Dummy Wafer Chamber State Preparation
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Solution Overview
Problem
The existing substrate treatment processes face challenges in maintaining consistent treatment quality due to differences in chamber states between the first and subsequent wafers, primarily because the chamber is not fully prepared when the first wafer is treated from an idle state.
Innovation Solution
A substrate treatment apparatus and method that utilize a Virtual Dummy Wafer (VDW) process, where the chamber state is prepared by moving the substrate support stage and gate valves before the next substrate treatment, simulating the conditions of actual substrate processing to equalize the treatment quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the chamber is used immediately from an idle state, then productivity is improved by avoiding idle time, but manufacturing precision deteriorates due to inconsistent treatment quality between first and subsequent wafers
Solution Approach 1:
The system performs preliminary actions by moving the substrate support stage and gate valves to their required positions before a wafer is actually introduced into the chamber. This pre-positioning of components ensures that when the wafer treatment begins, all mechanical components are already in their optimal positions, eliminating the quality difference between first and subsequent wafers while maintaining high productivity
2Manufacturing precision
If the chamber state is prepared in advance by moving substrate support stage and gate valves, then manufacturing precision is improved by ensuring consistent treatment quality, but device complexity increases due to additional control operations
Solution Approach 1:
The chamber state controller automatically performs the preparation operations without requiring additional manual intervention or complex external control systems. The system uses its existing control capabilities to move the substrate support stage and gate valves to the appropriate positions before wafer treatment, achieving consistent quality while avoiding unnecessary increases in device complexity
3Manufacturing precision
If the substrate support stage and gate valves are moved before substrate treatment, then manufacturing precision is improved by preparing chamber state, but loss of time occurs during the preparation period
Solution Approach 1:
The system maintains continuous useful action by performing the movement of the substrate support stage and gate valves during periods when the chamber would otherwise be idle or between wafer treatments. This approach ensures that the chamber is always ready for the next wafer without creating additional downtime, as the preparation actions are integrated into the existing operational workflow
Data Source
AI summary
Examples of a substrate treatment apparatus includes a chamber, a substrate support stage located inside the chamber, an elevation device that moves the substrate support stage up and down, a gate valve provided between the chamber and an adjacent chamber that is adjacent to the chamber, and a chamber state controller including a processor and a memory configured to cause the processor to execute a program stored in the memory, or including a dedicated circuitry, to move the elevation device and the gate valve before a next substrate treatment is performed in the chamber, in a state in which no substrate is present in the chamber.