Visible Light Communication SoC Integrating GaN LED on Silicon
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Solution Overview
Problem
Existing visible light communication (VLC) systems are hindered by large size, complex electronic boards, low performance, low reliability, and high costs due to the use of discrete electronic components, making them incompatible with mobile terminals like smartphones and tablets.
Innovation Solution
The development of a fully integrated System-on-a-Chip (SoC) and System-in-Package (SiP) solutions that integrate VLC encoders, LED drivers, and photodetectors on a silicon substrate with compound semiconductors like GaN, enabling a single-chip or module-based VLC system with enhanced performance and reduced size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If discrete electronic components are used in VLC systems, then the system can be assembled and manufactured, but the system size becomes large, complexity increases, and reliability decreases
Solution Approach 1:
The patent merges multiple discrete electronic components (VLC encoder, LED driver, photodetector, and supporting circuits) into a single integrated System-on-a-Chip (SoC) device. This consolidation eliminates the need for complex PCB assemblies, reduces the number of interconnections, and simplifies the overall system architecture while maintaining full VLC functionality.
Solution Approach 2:
The SoC device performs multiple functions within a single integrated platform: optical signal encoding, LED driving, photodetector signal reception, ambient light sensing, and data processing. This multi-functional integration reduces system complexity by eliminating the need for separate discrete components for each function.
2Ease of manufacture
If discrete electronic components are used in VLC systems, then the system can be assembled, but the system size becomes large and incompatible with mobile terminals
Solution Approach 1:
The patent integrates all VLC functional components into a single SoC chip, dramatically reducing the physical area occupied by the system. This miniaturization enables integration into mobile terminals like smartphones and tablets where space is constrained, while the chip remains manufacturable using standard semiconductor fabrication processes.
3Ease of manufacture
If discrete electronic components are used in VLC systems, then the system can be constructed, but reliability is low due to multiple connection points and components
Solution Approach 1:
The patent improves reliability by integrating all critical VLC components onto a single SoC chip, eliminating numerous solder joints, wire bonds, and connection points that exist in discrete component systems. Fewer interconnections mean fewer potential failure points, enhanced signal integrity, and improved overall system reliability.
4Ease of manufacture
If discrete electronic components are used in VLC systems, then the system can be assembled, but the cost is high due to complex electronic boards and assembly processes
Solution Approach 1:
The patent reduces costs by consolidating multiple discrete components into a single SoC chip, eliminating the need for complex PCB designs, multiple component procurement, and labor-intensive assembly processes. The integrated device can be manufactured using high-volume semiconductor fabrication, significantly reducing per-unit costs compared to discrete component assembly.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This integration results in a compact, high-performance, reliable, and cost-effective VLC system capable of achieving high data rates and compatibility with mobile devices, overcoming the limitations of traditional discrete-component-based systems.
Implementation Method 1
The compound semiconductor may be selectively grown on the second portion of the silicon substrate by (1) using a photo mask on the silicon substrate to define an opening; (2) depositing seeds into the opening; and (3) selectively growing the compound semiconductor in the opening.
Implementation Method 2
The LED may be configured as a VLC transmitter. The LED driver may be configured to drive the LED to emit visible light in accordance with the VLC signal.
Implementation Method 3
The photodetector may be configured as a VLC receiver to receive the VLC signal, and the integrated circuit may be configured to process the VLC signal received by the photodetector.
Data Source
AI summary
This disclosure relates to visible light communication (VLC) system-on-a-chip (SoC) systems/methods and VLC system-in-a-package (SiP) systems/methods. A VLC SoC system may include an integrated circuit comprising a VLC encoder and an LED driver fabricated on a first portion of a silicon substrate and an LED fabricated in a compound semiconductor selectively grown on a second portion of the silicon substrate. A VLC SiP system may include an integrated circuit comprising a VLC encoder and an LED driver fabricated on a silicon substrate and an LED fabricated in a compound semiconductor. The integrated circuit and the LED may be packaged in a SiP module. Interconnects may be formed between the integrated circuit and the LED.