Wafer Processing Device Assignment Using Post-Process Distance Metrics

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Solution Overview

Problem

The increasing complexity of semiconductor design rules has led to stricter requirements for semiconductor wafer standards, resulting in significant yield differences between devices, which affects wafer processing yield.

Innovation Solution

A management device that determines the optimal wafer processing device for a given type of wafers based on the distance between post-processing characteristics and a center value of the standard, adjusting processing conditions to ensure that post-processing characteristics meet the standard, thereby improving wafer processing yield.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If conventional double-side polishing method is used, then batch-to-batch variation in GBIR values is controlled, but yield difference between devices becomes significant under stricter design rules

Engineering Contradiction:

ImproveGBIR value controlVSAvoidwafer processing yield

Core Design Contradiction:

Manufacturing precisionVSReliability

Solution Approach 1:

The patent changes the parameter selection criteria from conventional GBIR value control to a new parameter system that calculates a comprehensive evaluation value based on multiple post-processing characteristics (flatness, roughness, thickness uniformity) and their respective weights. This parameter transformation enables more precise device selection that accounts for multiple quality dimensions simultaneously, resolving the yield variation problem under stricter design rules

Inventive Principle:

Principle #35Parameter changes

2Productivity

If multiple wafer processing devices are used, then productivity is improved, but device selection complexity increases

Engineering Contradiction:

Improvewafer processing throughputVSAvoiddevice selection complexity

Core Design Contradiction:

ProductivityVSDevice complexity

Solution Approach 1:

The patent implements a feedback mechanism where the selection determination unit continuously evaluates post-processing characteristics from the inspection device and updates device selection based on calculated evaluation values. This closed-loop feedback system automates the complex selection process, allowing multiple devices to be managed efficiently while maintaining optimal yield through data-driven decision-making

Inventive Principle:

Principle #23Feedback

Solution Approach 2:

The patent introduces an intermediary selection determination unit that acts as a mediator between multiple wafer processing devices and the final device selection. This intermediary calculates comprehensive evaluation values by integrating data from multiple sources (inspection device, process conditions, post-processing characteristics) and translates complex multi-dimensional data into a single ranking metric, simplifying the overall system architecture

Inventive Principle:

Principle #24Intermediary (Mediator)

Data Source

PatentUS20250353133A1Management device, management method, and wafer manufacturing system

Publication Date: 2025.11.20 SUMCO CORP

AI summary

A management device includes a control section which manages a plurality of wafer processing devices. The control section determines a wafer processing device to be assigned to process a given type of wafers from among the plurality of wafer processing devices, based on a distance between post-processing characteristics of wafers processed by each of the wafer processing devices and a center value of a standard for the given type of wafers.