Wafer-Bonded Optical Unit Assembly With Semi-Cured Adhesive Sealing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The manufacturing process for optical modules is complex and costly due to the assembly of separate collimator and aspherical lens or micro-optical elements, which can lead to reduced yield and optical performance issues.
Innovation Solution
A manufacturing method for an optical unit involving the molding of wafers with collimating and optical characteristic elements, followed by bonding with a semi-cured adhesive and cutting to form a sealed optical unit, which simplifies the structure and reduces manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a collimator element and aspherical lens or micro-optical element are assembled as separate components to a holder, then the optical module can be provided, but the manufacturing process becomes complicated and the structure becomes complicated, which increases manufacturing cost and decreases yield
Solution Approach 1:
The patent merges the collimator element and the aspherical lens or micro-optical element into a single integrated optical unit. This is achieved by forming both optical elements on the same substrate or by directly bonding them together as a unified structure, eliminating the need for separate assembly steps and reducing manufacturing complexity while improving yield.
Solution Approach 2:
The integrated optical unit serves multiple functions simultaneously - it provides both collimation and the optical characteristic function (aspherical lens or micro-optical element) in a single component assembly. This multi-functional design reduces the number of separate components needed and simplifies the overall manufacturing process.
2Device complexity
If the collimator element and aspherical lens or micro-optical element are bonded in advance to simplify structure, then the manufacturing process is simplified, but the optical performance may be affected by adhesive flow out
Solution Approach 1:
The patent introduces a positioning structure or alignment feature as an intermediary element between the collimator element and the aspherical lens or micro-optical element. This positioning structure prevents adhesive from flowing into optical areas while still allowing proper bonding, thus maintaining optical performance while enabling the simplified integrated structure.
Solution Approach 2:
The patent applies adhesive only in specific localized areas where it is needed for bonding, rather than across the entire surface. This controlled local application of adhesive prevents flow-out into optical paths while maintaining the structural integrity of the integrated optical unit, preserving optical performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method reduces manufacturing costs and improves yield by simplifying the assembly process and minimizing adhesive flow, which helps maintain optical performance.
Implementation Method 1
forming a bonding portion with a predetermined adhesive in a first peripheral portion provided and thus surrounding the first optical element in the first wafer or a second peripheral portion corresponding to the first peripheral portion, provided surrounding the second optical element in the second wafer; bonding the first wafer and the second wafer with the bonding portion
Data Source
AI summary
A manufacturing method for an optical unit includes: molding a first wafer in which a plurality of the first optical elements are formed; molding a second wafer in which a plurality of the second optical elements are formed; forming a bonding portion in a first peripheral portion surrounding the first optical element or a second peripheral portion corresponding to the first peripheral portion and surrounding the second optical element; bonding the first wafer and the second wafer with the bonding portion to seal the first optical element and/or the second optical element; and cutting the first wafer and the second wafer at the first and second peripheral portions in a state where the first and second wafers are bonded to each other to dice an optical unit, in which the adhesive in the bonding portion formed in the forming the bonding portion is in a semi-cured state.