Wafer Bonding Apparatus with Vacuum Grooves for Moisture Control
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Solution Overview
Problem
Wafer bonding processes often result in defects due to moisture trapped between wafers, caused by high-pressure air layers forming during bonding, which condense and cause voids.
Innovation Solution
A wafer bonding apparatus with movable lower and upper structures that adjust the interval between wafers to prevent moisture condensation by moving the position of air passage outside the wafer surfaces, using vacuum grooves and a controller to manage the bonding process and air flow.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If wafer bonding is performed with direct contact between wafers, then bonding strength is improved, but moisture gets trapped between wafers causing defects
Solution Approach 1:
A groove structure is introduced as an intermediary element between the wafers. This groove allows air and moisture to escape during the bonding process, preventing moisture trapping while maintaining direct wafer contact for strong bonding. The groove acts as a mediator that resolves the conflict between achieving strong bonding and preventing defect formation.
Solution Approach 2:
The groove structure creates a controlled porous pathway through the wafer interface. This porous structure allows selective passage of air and moisture vapor during bonding, enabling escape of trapped moisture while maintaining the overall integrity and bonding strength of the wafer interface.
2Productivity
If high pressure is applied during bonding, then bonding speed is improved, but air layers form and condense causing voids
Solution Approach 1:
The groove structure extracts or removes the trapped air layer from the bonding interface by providing an escape pathway. During high-pressure bonding, the groove allows air to be pushed out from between the wafers, preventing the formation of voids and defects while maintaining the high bonding speed achieved through high pressure.
3Device complexity
If wafer bonding is performed without separate media, then process simplicity is improved, but moisture condensation causes defects
Solution Approach 1:
Instead of changing the overall bonding process or introducing separate media, the groove structure applies a local modification to the wafer surface. This local quality change creates a specific region where moisture can escape, solving the moisture condensation problem while maintaining the simplicity of the direct bonding process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents defects by ensuring moisture does not condense between wafers, maintaining a controlled air flow that prevents moisture trap, thus ensuring reliable wafer bonding.
Implementation Method 1
using vacuum grooves and a controller to manage the bonding process and air flow
Data Source
AI summary
A wafer bonding apparatus is provided includes a lower support plate configured to structurally support a first wafer on an upper surface of the lower support plate; a lower structure adjacent to the lower support plate and movable in a vertical direction that is perpendicular to the upper surface of the lower support plate, an upper support plate configured to structurally support a second wafer on a lower surface of the lower support plate, and an upper structure adjacent to the upper support plate and movable in the vertical direction.