Wafer Carrier DLC Coating Strategy for Edge Damage Prevention
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Solution Overview
Problem
Conventional wafer carriers coated with diamond-like carbon (DLC) for increased abrasion resistance can damage the edge of wafers during double-sided polishing due to edge contact with the DLC coating layer, leading to defects and reduced carrier lifespan.
Innovation Solution
A method involving machining a carrier body to a pre-set shape, forming preliminary holes and slurry introduction holes, attaching mark members radially around the center point, coating with DLC, and then enlarging the preliminary holes to form wafer retaining holes without DLC on the inner surface, thereby preventing edge damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the wafer carrier is coated with DLC on the inner surface of the wafer retaining hole, then abrasion resistance is improved, but wafer edge damage occurs due to contact with the DLC coating layer
Solution Approach 1:
The patent applies local quality by selectively coating the DLC material only on specific regions of the wafer carrier - the outer surface and the bottom surface of the wafer retaining hole - while deliberately leaving the inner cylindrical surface of the wafer retaining hole uncoated. This localized coating approach allows the carrier to have high abrasion resistance where needed while preventing wafer edge damage where contact should be avoided.
2Duration of action of stationary object
If the wafer carrier is coated with DLC, then carrier lifespan is increased, but defects are caused to the wafer edge during polishing
Solution Approach 1:
The patent implements local quality by applying DLC coating to specific regions (outer surface and bottom surface) while excluding the inner surface of the wafer retaining hole from coating. This selective coating strategy extends carrier lifespan through enhanced abrasion resistance in high-wear areas while preventing defects on the wafer edge by maintaining a non-coated contact surface.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enhances the abrasion resistance of the wafer carrier, prevents wafer edge damage, and significantly increases the carrier's lifespan by avoiding DLC contact during polishing, thus improving wafer quality and carrier durability.
Implementation Method 1
the wafer carrier has been coated with diamond-like carbon (DLC)
Data Source
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AI summary
Provided is a method of manufacturing a wafer carrier (10) capable of providing good abrasion resistance to remarkably increase lifespan of the wafer carrier (10), and preventing occurrence of defects from an edge of a wafer (W) during double-sided polishing of the wafer (W). The method includes machining a carrier body (11) constituting the wafer carrier (10) in a pre-set shape, forming a preliminary hole (111a) and a slurry introduction hole (112) in the carrier body (11) of the wafer carrier (10), coating diamond-like carbon (DLC) on the carrier body (11) having the preliminary hole (111a), and, after coating the DLC, enlarging the preliminary hole (111a) to form a wafer retaining hole (111), into which the wafer (W) is inserted.