Wafer Chuck Cap Sealed Lip Reservoir for TSV Etching
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Solution Overview
Problem
Current semiconductor wafer manufacturing processes face challenges in forming high aspect ratio patterns with uniform film thickness, efficient chemical material usage, and preventing wafer contamination, especially in the wet etching process for through silicon via (TSV) methods.
Innovation Solution
An apparatus with a wafer chuck, a cap with a sealed lip to form a liquid reservoir, a nozzle for processing liquid injection and recovery, and electrodes for stirring, along with a processing liquid recovery system to minimize chemical usage and contamination, allowing for efficient processing and recycling of liquids.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a wet process is used to improve film uniformity, then film uniformity is improved, but chemical material is wastefully consumed and wafer contamination occurs
Solution Approach 1:
A cap with a sealed lip is placed on the wafer to create a liquid reservoir that confines the chemical material to only where needed on the wafer surface. This prevents chemical waste and contamination while maintaining uniform film formation through controlled liquid confinement.
Solution Approach 2:
The chemical material is extracted from a bulk tank environment and delivered precisely to the wafer surface through a nozzle system. This extraction approach allows the chemical to be applied only where needed, reducing overall consumption while maintaining processing effectiveness.
2Manufacturing precision
If a wet process is used to form high aspect ratio patterns, then pattern formation capability is improved, but process complexity and equipment needs increase
Solution Approach 1:
Multiple functions (chemical delivery, liquid confinement, waste recovery, and processing) are merged into a single integrated apparatus. The cap structure combines sealing, reservoir formation, and controlled delivery, eliminating the need for separate equipment for each function.
Solution Approach 2:
The cap structure serves multiple functions simultaneously: it seals the liquid reservoir, confines chemical material, enables controlled delivery, and facilitates recovery of excess chemical. This multi-functionality reduces overall system complexity while achieving high aspect ratio pattern formation.
3Productivity
If conventional wet process is used, then processing capability is maintained, but chemical material concentration cannot be uniformly maintained
Solution Approach 1:
The sealed liquid reservoir creates a controlled environment where chemical concentration can be precisely maintained. The system allows for monitoring and adjustment of chemical delivery, ensuring uniform concentration throughout the processing period while maintaining high productivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus enables the formation of high aspect ratio patterns with improved film uniformity, reduces chemical consumption, prevents wafer contamination, and integrates multiple processes into a single equipment setup, enhancing efficiency and reducing equipment needs.
Implementation Method 1
a nozzle injecting and recovering a processing liquid into the liquid reservoir
Implementation Method 2
a second electrode disposed to vertically face the wafer chuck with the wafer therebetween, the second electrode rotating to stir the processing liquid supplied onto the wafer
Implementation Method 3
a wafer chuck supporting and fixing a rear surface of the wafer
Implementation Method 4
the cap including a sealed lip that seals an outer peripheral portion of a top surface of the wafer to define a liquid reservoir
Data Source
AI summary
An apparatus for manufacturing a semiconductor wafer comprises: a wafer chuck which holds the rear surface of a wafer having a via hole; a cap which is installed in such a way as to move up and down above the wafer chuck and has a sealed lip which forms a liquid reservoir by sealing the outer peripheral portion of the upper surface of the wafer; and a nozzle which injects and recovers processing liquids to and from a reaction chamber.