Wafer Clamping Device Integrated Drive Mechanism
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Solution Overview
Problem
Existing wafer clamping devices for placement machines are complex and costly due to the need for separate actuators and energy supplies, which complicates the mechanical structure and increases production costs, while also lacking simplicity and secure fixation.
Innovation Solution
A clamping device that uses a drive integrated with the wafer table's movement mechanism, eliminating the need for a separate actuator, and employs a compact design with a movable clamping element actuated by spring tension, allowing for secure and precise wafer fixation without additional energy requirements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a separate actuator is used for wafer clamping, then reliable wafer fixation is achieved, but device complexity and production costs increase
Solution Approach 1:
The patent combines the wafer table drive mechanism with the wafer clamping function by integrating a clamping element that is actuated by the drive mechanism itself. The drive mechanism that moves the wafer table between positions also serves to actuate the clamping element, eliminating the need for a separate actuator and reducing device complexity while maintaining reliable wafer fixation.
2Reliability
If multiple individual clamps are arranged along the wafer circumference, then secure wafer clamping is achieved, but device complexity increases
Solution Approach 1:
The patent employs multiple individual clamping elements arranged along the circumference of the wafer, each capable of independent actuation. This segmentation allows secure clamping at multiple points around the wafer while maintaining relative simplicity in the overall mechanism, as each clamping element can be independently controlled by the drive mechanism without requiring complex interconnections.
3Ease of manufacture
If a compact clamping design is used, then production costs are reduced, but securing precise wafer fixation becomes difficult
Solution Approach 1:
The patent designs the clamping element to perform multiple functions: it provides clamping force to secure the wafer, it is actuated by the drive mechanism that also positions the wafer table, and it can be designed in various configurations (finger-like, plate-like) to accommodate different wafer sizes and types. This multi-functionality achieves compact design and cost reduction while maintaining precise wafer fixation through the integrated actuation system.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables cost-effective and compact wafer clamping with precise positioning, allowing for efficient handling and placement of unpackaged components directly from a wafer to a placement head, reducing production complexity and enhancing operational simplicity.
Implementation Method 1
a movable clamping element (361) which can be moved between a closed position, in which the wafer is clamped, and an open position in which the wafer can be inserted or removed; a spring element (365) for acting on the movable clamping element (361) in order to bring the movable clamping element (361) into the closed position
Data Source
Figure 1
Figure 2
Figure 3a~3b
AI summary
The device has a fixed clamping element and a movable clamping element, which is movable between an opening position and a closing position. A wafer is clamped between the fixed clamping element and the movable clamping element, if the movable clamping element is in the closing position. A spring element (365) is coupled with the movable clamping element. The movable clamping element is formed to bring the element in to a withdrawal position by using a stationary contact element (380) in the opening position with a movement of a supporting element (330). Independent claims are also included for the following: (1) a feeder device for uncovered elements (2) an assembly device for the automatic assembly of component support with component.