Wafer Cleaning Tank Layout for Integrated Scrub and Non-Contact Cleaning
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Solution Overview
Problem
Current roll scrub cleaning modules can only clean the peripheral edge of a wafer in a non-contact manner due to the difficulty in coexisting with a sponge cleaning mechanism and a non-contact cleaning mechanism within a narrow cleaning tank, leading to inefficiencies and extended processing times.
Innovation Solution
A cleaning apparatus with a swing mechanism that moves a cleaning member from a retracted position to a cleaning position within the cleaning tank, allowing for non-contact cleaning through a second cleaning means that passes directly above the center of the wafer, thereby reducing the footprint of the cleaning tank and preventing chemical solution leakage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a sponge cleaning mechanism and a non-contact cleaning mechanism are coexisting in a narrow cleaning tank, then both cleaning functions can be provided, but it is difficult to enable coexistence due to space constraints
Solution Approach 1:
The patent positions the non-contact cleaning mechanism above the wafer surface in the vertical dimension, allowing it to pass through the center of the wafer from top to bottom. This vertical arrangement enables coexistence with the horizontal sponge cleaning mechanism without requiring additional horizontal space in the narrow cleaning tank.
2Ease of operation
If a drive mechanism for moving the cleaning member is provided inside the cleaning tank, then the cleaning member can be moved from cleaning position to retracted position, but the footprint of the cleaning tank cannot be reduced
Solution Approach 1:
The drive mechanism for moving the cleaning member is extracted from inside the cleaning tank and arranged outside the cleaning tank. This allows the cleaning tank footprint to be reduced while still enabling the cleaning member to be moved from the cleaning position to the retracted position through the side wall opening.
3Ease of operation
If a large opening for running the drive mechanism is provided on the side wall of the cleaning tank, then the drive mechanism can access the cleaning member, but chemical solution scatters outside the tank when the shutter is open
Solution Approach 1:
A shutter made of flexible material is used to cover the opening on the side wall of the cleaning tank. The shutter can be opened to allow the drive mechanism to access the cleaning member and closed to prevent chemical solution from scattering outside the tank, thus eliminating harmful chemical leakage while maintaining operational access.
4Adaptability or versatility
If another cleaning module is installed before or after the roll scrub cleaning module for non-contact cleaning, then non-contact cleaning can be performed, but time loss is extended due to wafer passing through the conveyor mechanism once
Solution Approach 1:
The non-contact cleaning mechanism is merged with the roll scrub cleaning module by installing it within the same cleaning tank. This allows both non-contact cleaning and roll scrub cleaning to be performed in sequence without the wafer needing to pass through separate cleaning modules, thereby reducing time loss and improving processing efficiency.
Data Source
AI summary
A cleaning apparatus includes: a cleaning tank that defines a cleaning space for cleaning a wafer; a wafer rotation mechanism that is arranged inside the cleaning tank and holds and rotates the wafer; a cleaning member that contacts and cleans a surface of the wafer, is rotatable around a central axis extending in a lateral direction, and has a length in an axial direction longer than a radius of the wafer; a swing mechanism that swings the cleaning member around a swing axis located inside the cleaning tank to move the cleaning member from a retracted position outside of the wafer to a cleaning position directly above the wafer; a second cleaning means that cleans the surface of the wafer; and a second swing mechanism that swings the second cleaning means around a second swing axis located inside the cleaning tank to pass directly above a center of the wafer.