Residue-Collecting Chamber Structure for Wafer Curing Contamination

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Solution Overview

Problem

During semiconductor processing, polymer-based materials like polybenzoxazole (PBO) outgas when cured, leading to residues that can condense and drip onto wafers, causing defects.

Innovation Solution

A semiconductor apparatus with a collecting module that includes a flow-directing structure, a tray, and a baffle structure to collect and redirect residues of curable dielectric material away from the wafer, preventing contamination and defects.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If polymer-based materials are cured during semiconductor processing, then mechanical strength and hardness are improved, but residues are generated that can condense and drip onto wafers causing defects

Engineering Contradiction:

Improvemechanical strengthVSAvoidwafer defects

Core Design Contradiction:

StrengthVSObject-affected harmful factors

Solution Approach 1:

A collecting module with a flow-directing structure is introduced as an intermediary component between the curing zone and the wafer. This structure captures outgassed residues and redirects them into collection trays, preventing direct contact with wafers while allowing the curing process to proceed. The intermediary structure resolves the contradiction by managing the harmful byproduct without interfering with the beneficial curing effect.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The harmful residues are extracted from the processing environment using the flow-directing structure and collection module. By removing the condensed polymer drips from the vicinity of the wafers, the system maintains the mechanical strength benefits of curing while eliminating the defect-causing residues.

Inventive Principle:

Principle #2Taking out (Extraction)

2Reliability

If a collecting module is added to capture residues, then wafer defect occurrence is reduced, but device complexity increases

Engineering Contradiction:

Improvewafer defect reductionVSAvoidapparatus structure

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The flow-directing structure serves multiple functions: it directs gas flow, collects residues, prevents drip formation, and protects wafers. By combining these functions into a single integrated component, the system achieves reliable wafer protection without proportionally increasing complexity. The structure acts as a multi-functional element that addresses several issues simultaneously.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The collecting module is designed to be removable and replaceable, allowing easy disposal of collected residues and maintenance. This design philosophy reduces the operational complexity and makes the added structure manageable through standardized, modular components that can be quickly exchanged rather than requiring complex in-situ cleaning systems.

Inventive Principle:

Principle #34Discarding and recovering

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The collecting module effectively captures residues of curable dielectric material, preventing them from contacting the semiconductor wafer and thereby reducing the occurrence of wafer defects.

Implementation Method 1

residues of curable dielectric material... dripping from the ceiling of the chamber

Methodology Applied

Scientific EffectGravity: Gravitation

Implementation Method 2

The tray is moved together with the wafer cassette... and is positioned to cover the first hollow region of the flow-directing structure

Methodology Applied

Scientific EffectAccumulation:

Implementation Method 3

a baffle structure disposed below the flow-directing structure... configured to collect other portions of the residues

Methodology Applied

Scientific EffectPhysical containment: Physical Containment

Data Source

PatentUS12217989B2Semiconductor apparatus and method of collecting residues

Publication Date: 2025.02.04 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

A semiconductor apparatus and a method for collecting residues of curable material are provided. The semiconductor apparatus includes a chamber containing a wafer cassette, and a collecting module disposed in the chamber for collecting residues of curable material in the chamber. The collecting module includes a flow-directing structure disposed below a ceiling of the chamber, a baffle structure disposed below the flow-directing structure, and a tray disposed on the wafer cassette. The flow-directing structure includes a first hollow region, the baffle structure includes a second hollow region, and the tray is moved together with the wafer cassette to pass through the second hollow region of the baffle structure and is positioned to cover the first hollow region of the flow-directing structure.