Mechanical Wafer Debonding via Adhesive Edge Cutting
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Solution Overview
Problem
Current debonding methods for ultra-thin wafers face challenges such as excessive chemical immersion time, low productivity, and environmental concerns, particularly due to limitations in mechanical strength and viscosity during separation, which hinder efficient 3D packaging interconnection.
Innovation Solution
A mechanical debonding method and system that involves measuring the adhesive height, cutting the adhesive at the edge of temporary bonding wafers using a cutting apparatus, removing the carrier wafer, and cleaning the remaining adhesive, utilizing a thickness measurement apparatus, cutting apparatus, controlling apparatus, and removing apparatus to achieve efficient debonding without chemical immersion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If chemical immersion method is used for debonding, then the adhesive can be removed, but the processing time becomes excessive and productivity decreases
Solution Approach 1:
The patent replaces chemical immersion methods with a mechanical cutting apparatus that uses a blade to physically cut and separate the adhesive layer between wafers. This mechanical approach eliminates the need for lengthy chemical immersion processes while maintaining effective adhesive removal, thereby significantly improving productivity without sacrificing debonding effectiveness.
2Reliability
If chemical immersion method is used for debonding, then the adhesive can be removed, but the process becomes non-environmentally friendly
Solution Approach 1:
The patent substitutes chemical-based adhesive removal with a purely mechanical cutting process. The cutting apparatus physically severs the adhesive bonds without introducing harmful chemicals into the environment, thereby eliminating the environmental pollution associated with chemical immersion methods while maintaining effective adhesive removal.
3Reliability
If laser treatment is used to decrease adhesive viscosity, then the adhesive can be separated, but the method is limited to glass carrier wafers
Solution Approach 1:
The patent replaces laser treatment with a mechanical cutting apparatus that does not rely on optical absorption properties specific to glass. The cutting blade can physically cut through adhesive layers regardless of the carrier wafer material, enabling the method to be applied to silicon, glass, and other material combinations, thereby significantly improving adaptability while maintaining separation effectiveness.
4Reliability
If heat treatment is used for debonding, then the adhesive can be separated, but wafer warping occurs and heating budget must be considered
Solution Approach 1:
The patent replaces thermal processing with a mechanical cutting method that operates at ambient temperatures. The cutting apparatus physically cuts the adhesive layer without applying heat, thereby eliminating wafer warping and the need to manage heating budgets, while maintaining effective adhesive separation.
5Reliability
If ZoneBOND technology is used for debonding, then the adhesive can be separated, but long pre-brew time is required which reduces productivity
Solution Approach 1:
The patent replaces the chemical pre-brew process with immediate mechanical cutting. The cutting apparatus can directly cut through the adhesive layer without requiring any pre-soaking or pre-brew time, thereby eliminating the time loss associated with ZoneBOND technology while maintaining effective adhesive separation.
Data Source
AI summary
A mechanical debonding method and system are provided. A mechanical debonding method, used to debond temporary bonding wafers formed by bonding a device wafer and a carrier wafer by an adhesive, includes: obtaining the height position of the adhesive through a thickness measurement apparatus; moving a cutting apparatus to a position between the device wafer and the carrier wafer based on the height position of the adhesive, then removing the adhesive at the edge of the temporary bonding wafers by the cutting apparatus; removing the carrier wafer from the temporary bonding wafers; cleaning the adhesive left on the surface of the device wafer.