Wafer Developing Device With Region-Specific Airflow Control
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Solution Overview
Problem
In semiconductor fabrication, the inconsistent air flow rates and temperature gradients during the developing process of photoresist lead to non-uniformity in pattern sizes due to varying evaporation rates and temperature changes on the wafer surface.
Innovation Solution
A developing device with temperature sensors, independent air supply pipelines, and a control unit that adjusts air parameters based on temperature measurements to maintain target regions within a preset temperature range, ensuring uniformity by controlling airflow and temperature.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If air is continuously extracted from the development chamber through a single extraction pipeline at the bottom, then air extraction is achieved, but temperature gradients occur on the wafer surface due to inconsistent air flow rates across different regions
Solution Approach 1:
The single air extraction pipeline is segmented into multiple extraction pipelines distributed at different positions within the development chamber. This segmentation allows air to be extracted from multiple locations simultaneously, creating more uniform air flow distribution across the wafer surface and eliminating temperature gradients that cause pattern size non-uniformity.
Solution Approach 2:
The air extraction system transitions from a single-point extraction (bottom center) to multi-point extraction distributed in two or three dimensions throughout the chamber. This dimensional expansion of the extraction architecture enables uniform air removal from all regions of the wafer, preventing localized temperature variations.
2Productivity
If a single air supply pipeline is used to supply air to the development chamber, then air supply is achieved, but temperature distribution becomes non-uniform across different target regions on the wafer
Solution Approach 1:
The single air supply pipeline is divided into multiple independent air supply pipelines, each equipped with its own nozzle positioned over specific target regions on the wafer. This segmentation allows independent control of air flow to different regions, enabling precise temperature management across the entire wafer surface.
Solution Approach 2:
Each air supply pipeline is independently controlled and positioned to serve specific target regions on the wafer. This local quality approach allows different air flow rates and temperatures to be supplied to different regions based on their specific requirements, achieving uniform temperature distribution across the wafer surface.
3Device complexity
If air flow rates are not controlled uniformly across the wafer surface, then air extraction is simplified, but evaporation rates vary causing temperature changes and affecting development uniformity
Solution Approach 1:
Temperature sensors are installed in the development chamber to detect temperatures in different target regions. The control unit receives this temperature feedback and automatically adjusts the air flow rates of individual air supply pipelines to maintain uniform temperature distribution, thereby ensuring consistent development across the wafer surface.
Solution Approach 2:
The air supply system transitions from static, uniform air flow to dynamic, region-specific air flow control. Each air supply pipeline can independently adjust its air flow rate based on real-time temperature conditions, allowing the system to adapt to varying thermal conditions across different wafer regions and maintain optimal development uniformity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures uniform temperature distribution across the wafer surface, thereby maintaining consistent etching line widths and improving the uniformity of the developing process.
Implementation Method 1
a plurality of temperature sensors, disposed on the carrier, for detecting temperatures of a plurality of target regions
Implementation Method 2
ejecting airflows to surface of the wafer through a plurality of air supply pipelines
Implementation Method 3
extracting air inside a development chamber to outside the development chamber through an air extraction pipeline
Data Source
AI summary
The developing device comprises: a development chamber that is provided with an air extraction pipeline for extracting air inside the development chamber to outside the development chamber; a carrier that is disposed in the development chamber for supporting a wafer; a plurality of temperature sensors that are disposed on the carrier for detecting temperatures of a plurality of target regions; a plurality of mutually independent air supply pipelines for supplying air to the development chamber, each of the target regions corresponding to at least one air supply pipeline; and a control unit for acquiring measured temperatures of the temperature sensors and calculating current temperatures of the corresponding target regions, and basing on the current temperatures of the target regions to adjust air parameters of the corresponding air supply pipelines, so that the temperatures of the corresponding target regions rest within a preset temperature range.