Wafer Dimension Conversion for Standard Package Processing
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Solution Overview
Problem
Existing processing equipment is often configured for specific wafer dimensions, limiting its ability to accommodate wafers of different sizes and shapes, leading to the need for costly re-tooling and inefficiencies in manufacturing electro-photonic circuit packages.
Innovation Solution
Techniques for modifying the dimensions of wafers, such as converting an 8-inch wafer to a 12-inch diameter, by using a base plate or peripheral wafer with a cutout, and applying a molding compound to create a molded wafer package compatible with standard processing equipment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If processing equipment is configured for specific wafer dimensions, then processing precision is improved, but adaptability to different wafer sizes deteriorates
Solution Approach 1:
A dimension conversion structure is introduced as an intermediary component between the processing equipment and the wafer. This structure includes a first dimension matching the wafer's original dimensions and a second dimension matching the processing equipment's requirements, enabling compatibility without modifying either the wafer or the equipment
Solution Approach 2:
The solution transitions from directly processing the wafer in its original dimensions to processing it through a converted dimension format. The wafer is first converted to match equipment specifications, processed, then converted back to the final product dimensions, effectively adding a dimensional transformation layer to the workflow
2Manufacturing precision
If processing equipment is customized for specific wafer dimensions, then processing accuracy is improved, but manufacturing cost increases
Solution Approach 1:
The dimension conversion structure enables a single processing equipment to handle multiple wafer size specifications through the same equipment interface. This universal approach eliminates the need for multiple specialized equipment configurations, reducing overall manufacturing costs while maintaining processing accuracy
Solution Approach 2:
By introducing the dimension conversion structure as a mediator, the patent avoids the expense of customizing processing equipment for each wafer size. The conversion structure is a lower-cost solution that enables accurate processing of various wafer dimensions using standard equipment
3Adaptability or versatility
If wafer dimensions are converted using base plate or peripheral wafer methods, then equipment compatibility is improved, but process complexity increases
Solution Approach 1:
The dimension conversion process is divided into distinct segments: first converting the wafer to match equipment dimensions, then processing, and finally converting back to the desired product dimensions. This segmentation allows each step to be independently optimized and controlled, managing overall process complexity
Data Source
AI summary
The present disclosure relates to packaging techniques in connection with packaging electrical and optical components within circuit packages. For example, one or more examples described herein involve producing or manufacturing wafers having circuit packages formed thereon. Techniques described herein related to modifying a dimension of wafers in order that the wafers conform to a nominal dimension, such that the wafers may be implemented in connection with processing equipment that is specifically configured to operate on wafers of the nominal dimension.