Wafer Edge Dressing Using Peripheral Margin Cutting

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Solution Overview

Problem

The existing wafer processing methods require a separate dummy wafer for dressing, which is uneconomical and reduces productivity, as the dressing process necessitates frequent replacement of the wafer.

Innovation Solution

A wafer processing method that conditions the cutting edge by cutting the peripheral marginal area of the wafer itself, eliminating the need for a dummy wafer and reducing the need for wafer replacement during the dressing step, utilizing a cutting apparatus with a chuck table, cutting unit, X-axis, Y-axis, and Z-axis feeding mechanisms to position and operate the cutting blade.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a dummy wafer is used for dressing the cutting blade, then the cutting edge can be conditioned, but additional wafer preparation and replacement are required, reducing productivity

Engineering Contradiction:

Improvecutting edge conditionVSAvoidwafer processing efficiency

Core Design Contradiction:

ReliabilityVSProductivity

Solution Approach 1:

The wafer is made to serve multiple functions: it is used both for device fabrication and for dressing the cutting blade. By utilizing the peripheral marginal area of the same wafer for dressing, the system eliminates the need for separate dummy wafers and reduces wafer replacement operations, thereby improving productivity while maintaining cutting edge quality

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The wafer itself is used to dress the cutting blade through cutting operations on its peripheral marginal area. This self-service approach eliminates the need for external dummy wafers, as the wafer's own structure provides the necessary material for blade conditioning

Inventive Principle:

Principle #25Self-service

2Reliability

If a separate dummy wafer is prepared for dressing, then the cutting blade can be conditioned, but material consumption increases

Engineering Contradiction:

Improvecutting edge conditionVSAvoidwafer material usage

Core Design Contradiction:

ReliabilityVSLoss of substance

Solution Approach 1:

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The peripheral marginal area of the wafer, which would otherwise be discarded or unused, is utilized for dressing the cutting blade. This approach recovers value from what would be waste material, eliminating the need for separate dummy wafers and reducing overall material consumption

Inventive Principle:

Principle #34Discarding and recovering

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method enhances productivity by eliminating the need for a dummy wafer and reducing wafer replacement during dressing, allowing for efficient conditioning of the cutting edge without additional wafer preparation.

Implementation Method 1

a dressing step of cutting the peripheral marginal area by the cutting blade mounted to the cutting unit, to condition a state of the cutting edge

Methodology Applied

Scientific EffectAbrasion: Abrasion

Data Source

PatentUS12186857B2Wafer processing method

Publication Date: 2025.01.07 DISCO CORP

AI summary

A wafer processing method includes a holding step of holding a wafer on a chuck table; a dressing step of cutting a peripheral marginal area of the wafer by a cutting blade mounted to a cutting unit to condition a state of a cutting edge; and a dividing step of cutting streets by the cutting blade mounted to the cutting unit to divide the wafer into individual device chips.