Wafer Edge-Support Manipulator for Scratch-Free Transfer

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Solution Overview

Problem

Existing manipulators used in semiconductor processing cause scratches and contact marks on wafers during transfer, especially during back metal processes where wafers tend to curl, increasing contact area and scratch severity.

Innovation Solution

A manipulator with a finger structure and multiple support members arranged at intervals on the same circumference, designed to contact the edge of the wafer rather than its surface, preventing direct contact with the finger structure and reducing friction-induced scratches.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If the manipulator uses a conventional finger structure to transfer the wafer, then the wafer can be transferred, but the finger structure contacts the wafer surface causing scratches and contact marks

Engineering Contradiction:

Improvewafer transfer capabilityVSAvoidsurface scratches and contact marks

Core Design Contradiction:

Ease of operationVSObject-affected harmful factors

Solution Approach 1:

The manipulator finger structure is segmented into multiple support members arranged at intervals on the same circumference. Each support member independently contacts only the wafer edge, dividing the contact function into discrete points rather than continuous surface contact, thereby preventing scratches while maintaining transfer capability

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The support members act as intermediary elements between the finger structure and the wafer. These intermediaries are positioned to contact only the wafer edge, mediating the transfer force away from the vulnerable front surface and preventing direct harmful contact between the manipulator and wafer surface

Inventive Principle:

Principle #24Intermediary (Mediator)

2Adaptability or versatility

If the wafer is processed with back surface facing up (for back metal process), then the back metal deposition can be performed, but the wafer curls up increasing contact area with manipulator and worsening scratches

Engineering Contradiction:

Improveback metal process capabilityVSAvoidscratch severity due to wafer curling

Core Design Contradiction:

Adaptability or versatilityVSObject-affected harmful factors

Solution Approach 1:

The segmented support members are distributed at intervals around the circumference, creating discrete contact points at the wafer edge. This segmentation ensures that even when the wafer curls during back metal processing, only specific edge points contact the support members, minimizing the total contact area and preventing severe scratches

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The support members are specifically designed to contact only the local edge region of the wafer, not the entire surface. This localized contact approach allows the wafer to curl during back metal processing without increasing harmful contact area, as the contact is confined to the edge where curling occurs

Inventive Principle:

Principle #3Local quality

Data Source

PatentUS12263574B2Manipulator

Publication Date: 2025.04.01 BEIJING NAURA MICROELECTRONICS EQUIP CO LTD

AI summary

The manipulator of embodiments of the present disclosure is configured to transfer a wafer and includes a finger structure and a plurality of support members. The plurality of support members are arranged at the finger structure and distributed at intervals on a same circumference. Each support member is configured to contact an edge of the wafer to support the wafer to prevent the wafer from contacting the finger structure. With the manipulator of embodiments of the present disclosure, the wafer is prevented from contacting the finger structure to avoid scratches and contact marks generated at the surface of the wafer.