Wafer End Effector With Movable Edge Supports for Warped Wafers
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Solution Overview
Problem
The handling of warped substrates, particularly those subjected to increased heat or back grinding, poses challenges in semiconductor processing, requiring improved handling to prevent breakage or cracking.
Innovation Solution
An end effector with a fork-shaped main body and vacuum lines, featuring a central support and arc-shaped secondary supports with piezoelectric actuators, allows for secure gripping and handling of warped substrates by creating a vacuum suction effect and adjusting to different wafer types through a control module.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If standard wafer handling methods are used, then handling speed is maintained, but warped substrates are prone to breakage or cracking
Solution Approach 1:
The end effector is divided into multiple support structures: a first support structure with a first support surface for contacting the inner area of the wafer, and a second support structure with a second support surface for contacting the outer edge of the wafer. This segmentation allows each support structure to be optimized for specific regions of the wafer, providing reliable handling for both flat and warped areas without requiring a completely complex new system.
Solution Approach 2:
Different support surfaces are provided at different locations: the first support surface contacts the inner area while the second support surface contacts the outer edge. This local quality approach ensures that each region of the wafer receives appropriate support tailored to its specific condition, preventing breakage at vulnerable edges while maintaining overall reliability.
2Reliability
If multiple support structures are added to handle warped wafers, then substrate integrity is improved, but device complexity increases
Solution Approach 1:
The end effector is designed with multi-functional support structures that can handle both flat and warped wafers using the same basic mechanism. The first and second support structures work together to provide universal handling capability for different wafer types, achieving high reliability without requiring entirely separate handling systems for different wafer conditions.
Solution Approach 2:
The support structures are designed to adapt to different wafer conditions dynamically. The relative positioning and configuration of the first and second support surfaces allow the end effector to adjust to both flat and warped wafer geometries, providing reliable handling through dynamic adaptation rather than static complex mechanisms.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances the reliability of wafer handling, reducing breakage and cracking by securely gripping warped substrates, enabling efficient handling of both standard and warped wafers.
Implementation Method 1
a vacuum line formed in the main body, a first support arranged for contacting an inner area of a wafer, at least one opening within a boundary of the first support in communication with the vacuum line
Implementation Method 2
each of the at least two second supports may comprise a respective piezoelectric actuator configured to cause the respective second support to move between a wafer gripping position and a wafer release position
Data Source
Figure 1a~1b
Figure 1c
Figure 2a~2b
AI summary
An end effector for supporting a wafer is disclosed. The end effector comprises a main body, a vacuum line formed in the main body, a first support arranged for contacting an inner area of a wafer, at least one opening within a boundary of the first support in communication with the vacuum line, and at least one second support arranged for contacting an outer edge of a wafer.