Wafer Transfer Module Using Optical Alignment Feedback
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Solution Overview
Problem
In semiconductor manufacturing, the long transfer time in wafer transfer processes significantly affects production efficiency, and the increased production efficiency leads to stability issues such as wafer scratches due to positional deviations of the elevator and transfer arm, necessitating improved monitoring and control systems to prevent such deviations.
Innovation Solution
A wafer transfer module with a control system that uses transmitters and receivers to monitor the vertical position of both the elevator and the transfer arm, ensuring precise alignment and preventing scratches by controlling the transfer arm's movement based on signal changes, thereby maintaining the wafer's target position during transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If integrated wafer transfer mode is used to reduce transfer time, then productivity increases, but manufacturing precision deteriorates due to positional deviations causing wafer scratches
Solution Approach 1:
The patent implements a feedback mechanism using transmitters and receivers to continuously monitor the vertical positions of the elevator and transfer arm. The control system receives position signals from these sensors and adjusts the transfer process accordingly, preventing positional deviations that would cause wafer scratches while maintaining efficient integrated transfer operation.
Solution Approach 2:
The patent replaces purely mechanical position control with an optical sensing system (transmitters and receivers) combined with electronic control. This substitution enables precise non-contact measurement of vertical positions and automated control responses, achieving both high-speed transfer and high positioning accuracy.
2Loss of time
If transfer speed is increased to reduce transfer time, then loss of time decreases, but reliability deteriorates due to increased positional deviations
Solution Approach 1:
The control system continuously receives vertical position signals from transmitters and receivers during high-speed transfer operations. This real-time feedback enables the system to detect and correct positional deviations immediately, maintaining transfer process stability even at increased speeds.
Solution Approach 2:
The patent uses transmitters and receivers to monitor positions before transfer problems occur. By detecting vertical position deviations in advance, the control system can take preliminary corrective actions to prevent wafer scratches and maintain reliable operation during high-speed transfer.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution significantly reduces transfer time, enhances production efficiency, and ensures the stability of the wafer transfer process by preventing scratches caused by positional deviations, thereby maintaining high production quality.
Implementation Method 1
a first transmitter and a first receiver, wherein the first transmitter is disposed on the first transfer module sidewall, the first receiver is disposed on the second transfer module sidewall... the first receiver outputs a first wafer position signal E1 and the second receiver outputs a second wafer position signal E2
Data Source
AI summary
The present application relates to a wafer transfer module in a semiconductor manufacturing machine, relating to semiconductor integrated circuit manufacturing machines, wherein two sets of transmitter/receivers are provide on sidewalls of the wafer transfer module to monitor the travel position of an elevator, two sets of transmitter/receivers are provide on the sidewalls of the wafer transfer module to monitor the position of a transfer arm, a signal received by the receiver is transmitted to a control system such that the control system determines, according to the travel position of the elevator and the transfer arm position, whether the transfer arm can obtain a to-be-transferred wafer, thereby preventing the problem of a wafer scratch caused by an elevator position deviation or a transfer arm position deviation.