Wafer End Effector With Moving Clamp for Thin Wafer Handling
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Solution Overview
Problem
Current end effectors used in semiconductor wafer handling often damage or contaminate thin wafers due to mechanical forces, and struggle to accommodate varying wafer sizes and maintain wafer flatness during processing.
Innovation Solution
An end effector with a wafer support, bearing arm, and low-friction moving clamp that applies force to the wafer edge, using bi-directional drive and vacuum cylinder with seal-less glass tube and graphite piston, along with support pads and rollers to minimize contact and maintain wafer flatness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If mechanical forces are applied directly to the wafer, then the wafer can be gripped and transferred, but the wafer may be damaged or contaminated
Solution Approach 1:
The patent introduces an intermediary mechanism (the clamp with support pads) between the robotic arm and the wafer. The clamp applies mechanical force to grip the wafer edge, while the support pads provide a protective interface that minimizes direct contact forces on the wafer surface, thereby preventing damage and contamination while enabling effective gripping and transfer operations
2Device complexity
If a fixed end effector design is used, then the structure is simple, but it cannot accommodate varying wafer sizes
Solution Approach 1:
The patent implements a dynamic end effector design where the clamp can move along the bearing arm to accommodate different wafer sizes. The bearing arm itself can rotate and adjust position, allowing the same end effector to adapt to various wafer dimensions without requiring multiple specialized tools, thus maintaining simplicity while achieving versatility
Solution Approach 2:
The end effector is designed with universal capabilities to handle multiple wafer sizes through the adjustable bearing arm and movable clamp mechanism. A single device performs the function of multiple specialized end effectors by adapting its configuration based on the specific wafer size being processed
3Ease of operation
If traditional end effectors are used, then wafer handling is straightforward, but wafer flatness and warpage are not maintained
Solution Approach 1:
The patent applies local quality by positioning specific support pads at critical locations on the wafer surface. These pads provide localized support exactly where needed to maintain flatness and prevent warpage during handling, while other areas of the wafer remain untouched. The bearing arm and clamp are positioned to support the wafer in a way that distributes forces evenly and maintains the wafer's flat configuration throughout the handling process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The end effector effectively handles and transfers thin semiconductor wafers of multiple sizes without damaging or contaminating them, while maintaining wafer flatness and reducing warpage, enhancing processing efficiency.
Implementation Method 1
low friction vacuum cylinder may be engaged for the moving clamp motor. The vacuum cylinder may consist of a seal-less glass tube with a graphite piston
Implementation Method 2
a low friction moving clamp driven bi-directionally along a plane at least partially provided by the bearing arm, wherein the low friction moving clamp retractably applies force to a proximal edge of the semiconductor wafer
Data Source
AI summary
The disclosure provides an apparatus, system and method for providing an end effector. The end effector may be capable of accommodating semiconductor wafers of varying sizes, and may include: a wafer support; a bearing arm capable of interfacing with at least one robotic element, and at least partially bearing the wafer support at one end thereof; a plurality of support pads on the wafer support for physically interfacing with a one of the semiconductor wafers; and a low friction moving clamp driven bi-directionally along a plane at least partially provided by the bearing arm, wherein the low friction moving clamp retractably applies force to a proximal edge of the semiconductor wafer.