Dual-Mode Wafer End Effector for Pressure and Vacuum Handling
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Solution Overview
Problem
Conventional wafer-handling end effectors are limited in their ability to selectively engage and grip wafers of different sizes without contacting integrated circuit devices and cannot effectively utilize both pressure and vacuum forces for versatile handling.
Innovation Solution
The end effector design includes a blade with distinct pressure and vacuum force retention sides, integrated gas and vacuum distribution manifolds, and a surface extension, allowing selective engagement and gripping via pressure or vacuum forces, enabling handling of various wafer sizes and shapes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If conventional wafer-handling end effectors contact the upper surface within the edge exclusion zone, then they can convey wafers of a specific size, but they cannot handle wafers of different sizes or contact integrated circuit devices
Solution Approach 1:
The end effector is designed with a blade structure that can function in multiple modes: it can engage wafers from the upper surface within the edge exclusion zone, engage from the lower surface within the edge exclusion zone, and engage from the lower surface under the edge exclusion zone. This multi-functional design allows a single end effector to handle wafers of different sizes and configurations without requiring multiple specialized tools.
Solution Approach 2:
The end effector incorporates dynamic positioning capabilities that allow the blade to be positioned at different locations and orientations. The system can dynamically adjust whether to engage from the upper or lower surface and at different radial positions, enabling adaptation to various wafer sizes and handling requirements without changing the physical structure of the end effector.
2Adaptability or versatility
If conventional wafer-handling end effectors are configured to selectively lift wafers from the upper surface without contacting integrated circuit devices, then they can protect integrated circuit devices, but they are limited to specific wafer sizes and handling conditions
Solution Approach 1:
The end effector system dynamically adjusts its engagement strategy based on wafer size, orientation, and processing step requirements. The blade can be positioned to engage from the upper surface when needed, or from the lower surface at different radial positions, allowing the system to adapt to various handling conditions while maintaining reliable protection of integrated circuit devices through controlled engagement within exclusion zones.
3Adaptability or versatility
If a single end effector is designed to handle multiple wafer sizes and surfaces, then versatility is improved, but the complexity of the end effector structure increases
Solution Approach 1:
The end effector is segmented into distinct functional regions on the blade: an upper surface engagement region for contacting the upper surface within the edge exclusion zone, and lower surface engagement regions for contacting the lower surface both within and under the edge exclusion zone. This segmentation allows each region to be optimized for its specific function while maintaining overall structural simplicity.
Solution Approach 2:
The blade structure is designed as a universal component that integrates multiple engagement capabilities into a single element. Rather than using separate end effectors for different wafer sizes and surfaces, the universal blade design incorporates all necessary engagement regions and can be positioned to perform different functions, reducing overall system complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient and versatile wafer handling by allowing selective engagement and lifting of wafers without contacting integrated circuit devices, accommodating different sizes and shapes through a combination of pressure and vacuum forces.
Implementation Method 1
selectively engage a wafer via a pressure force
Implementation Method 2
selectively grip the wafer via a vacuum force
Data Source
AI summary
Wafer-handling end effectors configured to selectively engage a wafer via a pressure force and to selectively grip the wafer via a vacuum force, wafer-handling units that include the wafer-handling end effectors, systems that include the wafer-handling units, and methods of utilizing wafer-handling end effectors. The end effectors include a blade that defines a blade vacuum force retention side and an opposed blade pressure force retention side, a gas distribution manifold that extends at least partially within the blade and is in fluid communication with the blade pressure force retention side, and a vacuum distribution manifold that extends at least partially within the blade, is fluidically isolated from the gas distribution manifold within the blade, and is in fluid communication with the blade vacuum force retention side.