Wafer End Effector With Dual-Height Mounts for Contamination Control

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Solution Overview

Problem

Existing end effectors for wafer handling in semiconductor processing are limited to specific wafer types and require reconfiguration or replacement, leading to contamination risks and inefficiencies, particularly in vacuum transportation applications.

Innovation Solution

A dual-function end effector with a peripheral mount and base portion, supporting wafers and wafer assemblies on different horizontal planes, allowing versatile handling without reconfiguration, minimizing contamination, and reducing disturbance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If dedicated robotic arms with suitably configured end effectors are used for each wafer assembly type, then cross contamination between different wafer assemblies is avoided, but device complexity and reconfiguration requirements increase

Engineering Contradiction:
Improvecross contaminationVSAvoidreconfiguration requirements
Core Design Contradiction:
Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The end effector is designed with a universal base portion and interchangeable peripheral mounts that can be quickly swapped to accommodate different wafer assembly types. This multi-functionality allows a single end effector body to handle multiple wafer types without reconfiguration, eliminating cross-contamination risks while reducing device complexity

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The end effector is divided into a base portion and interchangeable peripheral mounts. This segmentation allows the peripheral mount to be replaced without affecting the base portion, enabling quick changeover between different wafer assembly types while maintaining contamination-free operation

Inventive Principle:
Principle #1Segmentation

2Manufacturing precision

If end effectors are replaced or reconfigured for different wafer types, then handling precision is maintained, but loss of time and productivity decrease

Engineering Contradiction:
Improvehandling precisionVSAvoidreconfiguration time
Core Design Contradiction:
Manufacturing precisionVSLoss of time

Solution Approach 1:

Multiple peripheral mounts for different wafer assembly types are pre-configured and stored ready for use. When a changeover is needed, the appropriate peripheral mount is already prepared and can be quickly installed without reconfiguration time, maintaining handling precision while eliminating downtime

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The end effector system transitions from a static, dedicated design to a dynamic, interchangeable system. The peripheral mounts can be quickly swapped to match the current production requirements, allowing the system to adapt rapidly without sacrificing precision

Inventive Principle:
Principle #15Dynamics

3Ease of operation

If end effectors contact the tape under the wafer, then handling is simplified, but the dies are inadvertently displaced after dicing

Engineering Contradiction:
Improvehandling simplicityVSAvoiddie displacement
Core Design Contradiction:
Ease of operationVSReliability

Solution Approach 1:

The peripheral mount is designed with contact points that locally engage only with the frame or tape edges, not the tape area under the wafer. This localized contact quality provides secure handling while preventing die displacement, balancing ease of operation with reliability

Inventive Principle:
Principle #3Local quality

Data Source

PatentUS20250229437A1End effector for carrying a wafer or a wafer assembly
Publication Date: 2025.07.17 SPTS TECH LTD
  • US20250229437A1 patent drawing
  • US20250229437A1 patent drawing
  • US20250229437A1 patent drawing

AI summary

An end effector for carrying a wafer or a wafer assembly placed thereon. The end effector is integrated with, may attach to, a robotic arm. The end effector includes a peripheral mount radially outside of a base portion, the peripheral mount includes at least a first mount section and a second mount section. The base portion has a substantially flat horizontal upper surface. Each mount section of the peripheral mount has a substantially flat horizontal upper surface being elevated with respect to the upper surface of the base portion. The end effector may hold a wafer assembly bridging the upper surfaces of the mount sections at a first height above the base portion. There is a step region between the base portion and the peripheral mount at each mount section. The end effector may hold a wafer bridging the support surfaces at a second height above the base portion.