Wafer End Effector Temperature Sensing for Accurate Mass Measurement

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Solution Overview

Problem

Temperature variations between semiconductor wafers and measurement apparatuses cause significant errors in mass measurement, particularly when wafers are transported at high temperatures, affecting throughput and accuracy in semiconductor processing.

Innovation Solution

An end effector with an integrated temperature sensor is used to detect the temperature of wafers during transportation, allowing for precise temperature measurement and control of cooling or heating processes to minimize temperature differences before measurement.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If a passive thermal transfer plate is used to equalize wafer temperature to the chamber temperature, then measurement accuracy is improved, but the throughput is reduced due to the long thermal equalization time

Engineering Contradiction:
Improvemass measurement accuracyVSAvoidwafer throughput
Core Design Contradiction:
Measurement precisionVSProductivity

Solution Approach 1:

The system performs preliminary cooling of the wafer using a Peltier device before the wafer reaches the measurement chamber. This advance thermal preparation reduces the temperature difference that would otherwise require long equalization time on the passive thermal transfer plate, thereby maintaining measurement accuracy while reducing overall processing time and improving throughput

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The system replaces part of the passive thermal conduction process with active Peltier device cooling. Instead of relying solely on slow thermal diffusion through the passive thermal transfer plate, the Peltier device provides active thermoelectric cooling to rapidly reduce wafer temperature before measurement, significantly reducing the thermal equalization time required

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

2Productivity

If the wafer temperature is not equalized before measurement, then throughput is maintained, but temperature variations cause significant errors in mass measurement

Engineering Contradiction:
Improvewafer throughputVSAvoidmass measurement accuracy
Core Design Contradiction:
ProductivityVSMeasurement precision

Solution Approach 1:

The system performs preliminary cooling of the wafer using a Peltier device before the wafer reaches the measurement chamber. This advance thermal preparation ensures the wafer temperature is sufficiently equalized to the chamber temperature, maintaining measurement accuracy without requiring long waiting times that would reduce throughput

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The system uses a temperature sensor to monitor wafer temperature in real-time during transport and adjustment processes. This feedback information is used to control the Peltier device cooling intensity and duration, ensuring the wafer reaches the appropriate temperature for accurate measurement while optimizing the processing time to maintain throughput

Inventive Principle:
Principle #23Feedback

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enables accurate mass measurement by reducing temperature-induced errors, maintaining throughput, and improving the precision of semiconductor wafer processing.

Implementation Method 1

an end effector for supporting a wafer, the end effector having a temperature sensor that is configured to sense a temperature of a wafer supported by the end effector

Methodology Applied
Scientific EffectTemperature sensing: Thermocouple

Implementation Method 2

a cooling or heating part for cooling or heating a wafer

Methodology Applied
Scientific EffectThermal transfer: Conduction (thermal)

Data Source

PatentUS20260005049A1End effector
Publication Date: 2026.01.01 LAM RES CORP
  • US20260005049A1 patent drawing
  • US20260005049A1 patent drawing
  • US20260005049A1 patent drawing

AI summary

An end effector for supporting a wafer, the end effector having a temperature sensor that is configured to sense a temperature of a wafer supported by the end effector.