Wafer End Effector With Adaptive Edge Support for Warped Substrates

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Solution Overview

Problem

The handling of warped substrates, particularly wafers with back grinding, poses challenges in semiconductor processing, requiring improved handling to prevent breakage or cracking.

Innovation Solution

An end effector with a main body, vacuum line, and supports for both inner and outer wafer areas, utilizing piezoelectric actuators to adjust grip position, and a control module for adapting to different wafer types, enhances handling capabilities.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If a single support structure is used for wafer handling, then the device complexity is low, but it cannot adequately handle both flat and warped wafers

Engineering Contradiction:

Improvehandling capability for different wafer typesVSAvoidend effector structure

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The end effector is divided into multiple support structures: a first support structure with a first support surface for contacting the inner area of the wafer, and a second support structure with a second support surface for contacting the outer edge of the wafer. This segmentation allows each support structure to be independently positioned and adjusted, enabling the end effector to accommodate both flat and warped wafers effectively.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The second support structure is configured to be movable relative to the first support structure, allowing dynamic adjustment of the support surfaces. This movability enables the end effector to adapt its configuration based on the wafer type being handled, providing versatility while maintaining a relatively simple base structure.

Inventive Principle:

Principle #15Dynamics

2Reliability

If vacuum suction is applied to hold the wafer, then the wafer is securely held, but warped wafers may still break or crack

Engineering Contradiction:

Improvewafer holding securityVSAvoidwafer breakage and cracking

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

Different support surfaces are provided at different locations on the wafer: the first support surface contacts the inner area while the second support surface contacts the outer edge. This local differentiation ensures that warped portions of the wafer are properly supported, preventing breakage or cracking while maintaining secure holding through vacuum suction.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The end effector is configured to provide preliminary support to warped portions of the wafer before vacuum suction is fully applied. By having the second support structure positioned to contact the outer edge first, the wafer is pre-supported in its warped state, preventing damage during the picking-up process.

Inventive Principle:

Principle #10Preliminary action

3Adaptability or versatility

If the second support is fixed in position, then the device complexity is reduced, but it cannot adapt to different wafer types and positions

Engineering Contradiction:

Improveadjustment to different wafer configurationsVSAvoidmovable support mechanism

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

Inventive Principle:

Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Improves handling reliability, reducing wafer breakage and cracking, especially for warped wafers, by providing secure vacuum suction and adjustable grip mechanisms.

Implementation Method 1

a vacuum line formed in the main body, a first support arranged for contacting an inner area of a wafer, at least one opening within a boundary of the first support in communication with the vacuum line

Methodology Applied

Scientific EffectVacuum suction: Vacuum

Implementation Method 2

each of the at least two second supports may comprise a respective piezoelectric actuator configured to cause the respective second support to move between a wafer gripping position and a wafer release position

Methodology Applied

Scientific EffectPiezoelectric effect: Piezoelectric Effect

Data Source

PatentUS20250364305A1Wafer handling end effector

Publication Date: 2025.11.27 ASM IP HLDG BV

AI summary

An end effector for supporting a wafer is disclosed. The end effector comprises a main body, a vacuum line formed in the main body, a first support arranged for contacting an inner area of a wafer, at least one opening within a boundary of the first support in communication with the vacuum line, and at least one second support arranged for contacting an outer edge of a wafer.