Wafer Grinding Abnormality Detection via Grindstone Wear Rate
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Solution Overview
Problem
Current wafer grinding technologies face challenges in accurately determining whether a grinding state is abnormal or normal, leading to inefficiencies and increased costs due to the low detection rate of wafer abnormalities such as breaking or cracking.
Innovation Solution
A wafer grinding apparatus that uses a grindstone with a special wear rate of 5% to 200% to determine the grinding state by analyzing the load current and grinding wear amount, enabling more accurate detection of abnormalities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Duration of action of stationary object
If a grindstone with general wear rate (less than 5%) is used for grinding, then the grindstone maintains its shape and lasts longer, but the detection accuracy of wafer abnormalities decreases
Solution Approach 1:
The patent changes the wear rate parameter of the grindstone from the general range (less than 5%) to a specific range (5% to 200%). This parameter change enables the grindstone to generate sufficient wear debris that can be detected by the detection apparatus, thereby achieving high-accuracy abnormality detection while the grindstone still maintains adequate lifespan for practical use.
2Measurement precision
If monitoring parameters are adjusted to detect abnormalities, then detection sensitivity increases, but false detection rate increases
Solution Approach 1:
The patent introduces wear debris as an intermediary medium between the grinding process and the detection system. The detection apparatus detects abnormalities by measuring wear debris characteristics rather than directly monitoring grinding forces or vibrations. This intermediary approach enables sensitive detection of abnormalities while maintaining low false detection rates, as wear debris provides clear diagnostic information about wafer conditions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The use of a grindstone with a special wear rate allows for high-accuracy determination of abnormal grinding states, significantly increasing the detection rate of wafer abnormalities and reducing the likelihood of subsequent processing errors.
Implementation Method 1
a water placed on a grinding table is ground with a rotating grindstone for grinding
Implementation Method 2
a load current of a motor for rotating the grindstone in the grinding processing
Data Source
AI summary
A wafer grinding apparatus performs grinding processing for grinding a semiconductor wafer with a grindstone. The grindstone has a wear rate as a characteristic. The wear rate is 5% or more, and less than 200%. A determination part performs determination processing for determining whether a grinding state with respect to the semiconductor wafer is abnormal or normal, based on at least one of a load current of a motor and a grinding wear amount.