Wafer Grinding Method Using Integrated Height Recognition
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing wafer grinding methods require complex configurations and separate measurement tools to accurately adjust the height of annular projections, leading to inefficiencies and potential errors in the grinding process.
Innovation Solution
A wafer grinding method using a grinding apparatus with a rotatable grinding wheel, vertical and horizontal moving means, and height recognition systems to adjust the height of annular projections without external measuring gauges, allowing for precise adjustment of the annular projection height based on predetermined values.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a separate measuring gauge and gauge moving means are provided to measure the height of the annular projection, then the height measurement accuracy is improved, but the device complexity increases
Solution Approach 1:
The height measuring gauge is designed to perform multiple functions: it measures both the height of the circular recess bottom surface and the height of the annular projection upper surface. The gauge moving means moves the single gauge between different measurement positions, eliminating the need for separate measuring devices for each surface.
Solution Approach 2:
The invention merges the measurement functions for the circular recess bottom surface and the annular projection upper surface into a single integrated system. The same height measuring gauge and moving means are used for both measurements, combining what would traditionally require separate measurement systems.
2Manufacturing precision
If the annular projection height is not accurately controlled, then the manufacturing process is simplified, but the manufacturing precision deteriorates
Solution Approach 1:
The invention implements a feedback control system where the height measuring gauge measures the actual height of the annular projection upper surface, and this measurement is compared with the target height value. The grinding process is adjusted based on this feedback to achieve the precise target height, ensuring manufacturing precision through closed-loop control.
Solution Approach 2:
The system performs preliminary measurement of the circular recess bottom surface height before grinding the annular projection. This preliminary action allows the system to calculate the required grinding amount and set the appropriate grinding depth, ensuring that the final annular projection height matches the target value precisely.
3Measurement precision
If multiple separate measurement systems are used, then the measurement coverage is improved, but the loss of time increases
Solution Approach 1:
The height measuring gauge continuously measures both the circular recess bottom surface and the annular projection upper surface without interruption. The gauge moving means enables seamless transition between measurement positions, maintaining continuous useful action and eliminating idle time between separate measurement operations.
Solution Approach 2:
The system performs preliminary measurement of the circular recess bottom surface height before proceeding to grind and measure the annular projection. This preliminary measurement is integrated into the overall process flow, allowing the system to plan and execute subsequent operations efficiently without time-wasting interruptions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method simplifies the grinding process by eliminating the need for separate measurement tools, enabling accurate and efficient adjustment of annular projection heights, reducing the risk of errors and mechanical complications, and improving handling and cutting precision.
Implementation Method 1
grinding means including a rotatable grinding wheel having a plurality of abrasive members annularly arranged so as to form a circular ring... the abrasive members being adapted to grind a central portion of the wafer
Data Source
AI summary
A wafer grinding method includes grinding a central portion of a wafer by using a plurality of abrasive members annularly arranged so as to form a circular ring, thereby forming a circular recess at the central portion of the wafer and simultaneously forming an annular projection around the circular recess, recognizing a height of a grinding unit after grinding the center by using a height recognizing unit and next storing the height recognized above, and grinding an upper surface of the annular projection to a predetermined value for a height of the annular projection previously set by a setting section as a grinding end height where the grinding of the annular projection by the grinding unit is ended.