Wafer Heating Assembly With Adjustable Cooling Gap
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Solution Overview
Problem
Existing heating devices in semiconductor apparatuses struggle to maintain consistent temperature due to inefficiencies in heat exchange, limiting their application range to either high or low temperatures, and prolonging maintenance times.
Innovation Solution
A heating device with a cooling structure that allows selective heat exchange at different positions relative to the heating body, utilizing a cooling lift assembly to adjust distance and a bellows shaft for sealing, enabling flexible temperature control across a wider range.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a cooling device is used to cool the heater, then the heater temperature can be maintained at a relatively low temperature, but the temperature application range of the heater is limited and cannot satisfy high temperature requirements
Solution Approach 1:
The patent applies the dynamics principle by making the cooling structure movable relative to the heating body. The cooling structure can be positioned at different distances from the heating body through a lifting mechanism, allowing dynamic adjustment of heat exchange efficiency. When the cooling structure is close to the heating body, it provides strong cooling for low-temperature processes; when moved away, cooling effect is reduced, enabling high-temperature processes. This dynamic positioning resolves the contradiction between maintaining low temperature and expanding temperature application range.
Solution Approach 2:
The patent implements parameter changes by varying the distance parameter between the cooling structure and the heating body. By changing this spatial parameter, the heat exchange efficiency parameter is adjusted accordingly. The system transitions from a fixed cooling configuration to a variable one where the distance parameter can be modified to match different process temperature requirements, thus expanding the temperature application range while maintaining effective temperature control.
2Loss of energy
If the cooling structure is fixed close to the heating body, then cooling efficiency is high, but the heater cannot maintain high temperature for certain processes
Solution Approach 1:
The patent transforms the fixed cooling structure into a dynamic one that can adjust its position relative to the heating body. The lifting mechanism enables the cooling structure to move between different distances, allowing the system to optimize heat dissipation efficiency according to process requirements. For high-temperature processes, the cooling structure is positioned farther away, reducing heat dissipation; for low-temperature processes, it is positioned closer, increasing heat dissipation efficiency.
3Temperature
If the cooling structure is fixed far from the heating body, then the heater can maintain high temperature, but the heater cannot be cooled effectively for low temperature processes
Solution Approach 1:
The dynamic positioning capability allows the cooling structure to be moved close to the heating body when high cooling efficiency is needed for low-temperature processes, and moved away when high temperature maintenance is needed. This resolves the contradiction by making the system adaptable rather than fixed, ensuring optimal heat dissipation efficiency across the entire temperature range.
4Stability of the object's composition
If simultaneous heating and cooling control is used, then temperature can be maintained unchanged, but the temperature application range is limited and maintenance time increases
Solution Approach 1:
The patent resolves this contradiction by dynamically adjusting the position of the cooling structure rather than relying on simultaneous heating and cooling control. The lifting mechanism allows the cooling structure to be positioned optimally for each process temperature requirement, eliminating the need for complex simultaneous control while expanding the temperature application range. This reduces maintenance time by simplifying the control mechanism.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device expands the temperature range of the heating device to accommodate various process requirements, improving temperature uniformity and reducing maintenance time.
Implementation Method 1
a heating member configured to generate heat being arranged in the heating body
Implementation Method 2
a cooling member configured to perform heat exchange with the heating body being arranged in the cooling body
Data Source
AI summary
The present disclosure discloses a heating device in a semiconductor apparatus and the semiconductor apparatus, including a heating body configured to carry a wafer, a heating member configured to generate heat being arranged in the heating body; and a cooling structure, which is arranged on the heating body below, and a cooling structure being arranged below the heating body. The cooling structure is configured to perform heat exchange with the heating body selectively at different positions away from the heating body. The heating device in the semiconductor apparatus and the semiconductor apparatus of the present disclosure are configured to expand an application temperature range of the heating device to satisfy different temperature requirements.