Wafer Jig Offset Acquisition via Tapered Surface Guidance
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Solution Overview
Problem
Existing robot systems for automatic teaching in semiconductor manufacturing face challenges in accurately detecting and correcting positional offsets between command and actual positions, leading to reduced operation accuracy and increased labor.
Innovation Solution
A robot system comprising a robot, a wafer jig with a tapered surface, a positioning base with contacting members, and a positional displacement detection device, where the wafer jig is placed on the positioning base to determine its position and then conveyed to the detection device to detect positional displacement, allowing for automatic acquisition of offsets and improved accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the robot conveys the wafer jig manually for offset detection, then the offset can be detected, but the labor requirement increases and automation is reduced
Solution Approach 1:
The system enables self-service automatic teaching by having the robot automatically convey the wafer jig to the detection device and acquire offset data without manual intervention. The robot performs the entire offset detection process autonomously, eliminating the need for manual operation while maintaining high measurement precision.
Solution Approach 2:
The system implements feedback by detecting the actual position of the wafer jig using the detection device, comparing it with the command position, and acquiring the offset data. This feedback loop enables the robot to automatically correct positioning errors and improve operation accuracy through continuous measurement and adjustment.
2Productivity
If the robot places the wafer jig without precise positioning, then the operation speed increases, but the offset detection accuracy decreases
Solution Approach 1:
The system replaces manual mechanical positioning with an automated detection and measurement system. The detection device optically or electronically measures the positional displacement of the wafer jig, eliminating the need for manual alignment while maintaining high detection accuracy. This substitution enables both high speed and high precision in the offset detection process.
3Measurement precision
If multiple reference members are arranged to surround the reference position, then the positioning accuracy improves, but the device complexity increases
Solution Approach 1:
The system extracts and utilizes the existing wafer jig itself as the reference object, eliminating the need for separate reference members. The wafer jig's known geometry and positioning features are directly used for offset detection, simplifying the device structure while maintaining positioning accuracy.
Solution Approach 2:
The wafer jig serves multiple functions: it is both the workpiece to be handled and the reference object for offset detection. This multi-functionality eliminates the need for separate reference members, reducing device complexity while maintaining the ability to achieve high positioning accuracy through the jig's inherent geometric features.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables easy detection of positional offsets, automates the correction of command positions, and significantly reduces labor requirements by using the wafer jig and detection device to improve operation accuracy.
Implementation Method 1
The wafer jig has a tapered surface. The tapered surface guides the wafer jig so that a center of the wafer jig approaches a predetermined position as a position where the tapered surface contacts the contacting members is relatively higher.
Implementation Method 2
The positional displacement detection device can detect displacement of the wafer jig with respect to a detection reference position.
Data Source
AI summary
A robot system according to an embodiment may include a robot, a wafer jig that is held by the robot, a positioning base, a positional displacement detection device, a control part, and an offset acquisition part for acquiring an offset that occurs between a command position for the robot and an actual position. The positioning base includes contacting members. The wafer jig has a tapered surface. The tapered surface guides the wafer jig so that a center of the wafer jig approaches a predetermined position as a position where the taped surface contacts the contacting members is relatively higher. The robot places the wafer jig on the positioning base, then holds and conveys the wafer jig to the positional displacement detection device. The offset acquisition part acquires the offset based on a result in which the positional displacement detection device detects a positional displacement of the conveyed wafer jig.