Wafer Lamination Tape Tension Control With Vacuum Guide Table
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Solution Overview
Problem
During the lamination process for semiconductor chip manufacturing, abnormal conditions such as warping of the wafer and/or press roller can lead to a tension imbalance in the lamination tape, causing defects in semiconductor chips.
Innovation Solution
A laminating device is designed with a substrate support, a guide table surrounding the circumference of the target substrate, and a press roller that attaches a lamination tape to the upper surfaces of the target substrate and guide table. The guide table includes multiple vacuum holes to adsorb the lamination tape, and clamping members are used to secure the lamination tape, thereby reducing tension imbalance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a press roller is used to attach lamination tape to the wafer, then the lamination process can be performed, but warping of the wafer and press roller can occur leading to tension imbalance in the lamination tape
Solution Approach 1:
The guide table is divided into multiple vacuum zones with independently controllable vacuum holes, allowing different regions to apply different vacuum forces. This segmentation enables precise control of the lamination tape tension in different areas, preventing tension imbalance while maintaining the lamination process.
Solution Approach 2:
The vacuum pressure is dynamically adjusted in different regions of the guide table to compensate for wafer warping and press roller deformation. By changing the vacuum parameter spatially, the system maintains balanced tension in the lamination tape despite physical distortions during the lamination process.
2Manufacturing precision
If vacuum holes are added to the guide table to control lamination tape tension, then tension imbalance is reduced, but device complexity increases
Solution Approach 1:
The guide table serves multiple functions: it guides the lamination tape, provides vacuum adsorption to control tension, and supports the wafer during the lamination process. By making the guide table multi-functional, the patent avoids adding separate components for each function, thereby reducing overall device complexity while maintaining precise tension control.
3Manufacturing precision
If clamping members are used to secure the lamination tape, then tension imbalance is reduced, but the lamination process becomes more complex
Solution Approach 1:
The clamping members are integrated with the guide table structure, combining the clamping function with the existing guide table. This merging eliminates the need for separate clamping mechanisms and simplifies the overall lamination system while maintaining effective tension control through the coordinated action of vacuum holes and clamping members.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The laminating device effectively prevents defects in semiconductor chips by maintaining a balanced tension in the lamination tape, improving the yield of semiconductor chip manufacturing.
Implementation Method 1
The guide table includes a plurality of vacuum holes that extend from the upper surface of the guide table and provide a negative pressure
Implementation Method 2
The guide table includes plurality of vacuum holes that adsorb the lamination tape
Data Source
AI summary
A laminating device that prevents defects in a semiconductor chip caused by tension imbalance includes a substrate support on which a target substrate is disposed, a guide table that surrounds a circumference of the target substrate, and a press roller that attaches a lamination tape by pressing the lamination tape against upper surfaces of the target substrate and the guide table. The guide table includes plurality of vacuum holes that adsorb the lamination tape.